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GSW全文库(10)
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CNKI期刊论文0611(24)
Springer电子图书(1)
CNKI学位论文(9577)
知网期刊论文(4108)
在“
Elsevier电子期刊
”中,
命中:
3,470
条,耗时:0.0419823 秒
在所有数据库中总计命中:
13,737
条
1.
Fabrication of durable superhydrophobic electrodeposited tin surfaces with tremella-like structure on
copper
substrate
作者:
Ge He
;
Shixiang Lu
;
shixianglu@bit.edu.cn
;
Wenguo Xu
;
Jianying Yu
;
Bei Wu
;
Shuo Cui
关键词:
Tin
;
Copper
;
Electrodeposition
;
Superhydrophobic
刊名:Surface and Coatings Technology
出版年:2017
2.
Full densification of inkjet-printed
copper
conductive tracks on a flexible
substrate
utilizing a hydrogen plasma sintering
作者:
Young-Tae Kwon
a
;
Young-In Lee
b
;
Seil Kim
a
;
Kun-Jae Lee
c
;
Yong-Ho Choa
a
;
choa15@hanyang.ac.kr
关键词:
Inkjet printing
;
Copper
conductive tracks
;
Full densification
;
Plasma sintering
;
Flexible
substrate
s
刊名:Applied Surface Science
出版年:2017
3.
Copper
nanowire coated carbon fibers as efficient
substrate
s for detecting designer drugs using SERS
作者:
Vladimir Halouzka
a
;
c
;
1
;
Barbora Halouzkova
b
;
1
;
David Jirovsky
a
;
Dusan Hemzal
d
;
Peter Ondra
c
;
Eirini Siranidi
e
;
Athanassios G. Kontos
e
;
Polycarpos Falaras
e
;
Jan Hrbac
b
;
关键词:
Copper
nanowire
;
SERS
;
Designer drugs
;
SERS
substrate
;
Carbon fiber
;
Electrodeposition
刊名:Talanta
出版年:2017
4.
Superhydrophobic
copper
surfaces fabricated by fatty acid soaps in aqueous solution for excellent corrosion resistance
作者:
Wenlong Xu
;
Yuanyuan Hu
;
Wenda Bao
;
Xiaoyu Xie
;
Yiran Liu
;
Aixin Song
;
songaixin@sdu.edu.cn
;
Jingcheng Hao
关键词:
One-step immersing method
;
Aqueous solution
;
Copper
substrate
;
Superhydrophobic surface
;
Corrosion resistance
刊名:Applied Surface Science
出版年:2017
5.
Deposition of hermetic silver shells onto
copper
flakes
作者:
John I. Njagi
;
Christopher M. Netzband
;
Dan V. Goia
;
goiadanv@clarkson.edu
关键词:
Copper
flakes
;
Silver nanoparticles
;
Galvanic displacement
;
Glucose
;
Silver diamine
;
Electroless plating
刊名:Journal of Colloid and Interface Science
出版年:2017
6.
Fractal inductors on flexible plastic
substrate
fabricated by laser ablation
作者:
Snezana M. Djuric
;
snesko@uns.ac.rs
;
Georges Dubourg
georgesdubourg@uns.ac.rs
关键词:
Inductors
;
Fractal design
;
Flexible
substrate
;
High frequency
;
Laser ablation
刊名:Microelectronic Engineering
出版年:2017
7.
Electrodeposition of porous
copper
as a
substrate
for electrocatalytic material
作者:
Himanshu Singh
;
Dheeraj P.B.
;
Yash Pratap Singh
;
Gaurav Rathore
;
Mukesh Bhardwaj
;
bhardfmt@iitr.ac.in
关键词:
Electrodeposition
;
Porous
copper
;
Hydrogen bubble dynamic template
;
Electrocatalyst
;
Electrochemical impedance spectroscopy
;
Scanning electron microscopy
刊名:Journal of Electroanalytical Chemistry
出版年:2017
8.
Enhanced electrical conductivity and reliability for flexible
copper
thin-film electrode by introducing aluminum buffer layer
作者:
Siliang Yin
;
Wei Zhu
;
zhu_wei@buaa.edu.cn
;
Yuan Deng
;
dengyuan@buaa.edu.cn
;
Yuncheng Peng
;
Shengfei Shen
;
Yubin Tu
关键词:
Flexible
copper
thin-film electrode
;
Al buffer layer
;
Adhesion
;
Electrical conductivity
;
Mechanical reliability
刊名:Materials & Design
出版年:2017
9.
Three dimensional material removal model of laser-induced backside wet etching of sapphire
substrate
with CuSO
4
solutions
作者:
Xiaozhu Xie
;
xiaozhuxie@gdut.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Xiandong Huang
;
Wei Jiang
;
Xin Wei
;
Wei Hu
;
Qinglei Ren
关键词:
Laser-induced backside wet etching (LIBWE)
;
Copper
deposition
;
Material removal model
;
Transient temperature field
;
Sapphire
substrate
刊名:Optics & Laser Technology
出版年:2017
10.
Simple fabrication of superhydrophobic/superoleophobic surfaces on
copper
substrate
by two-step method
作者:
Yongquan Qing
a
;
qingyq88@163.com
;
Chuanning Yang
a
;
Qingqing Zhao
b
;
Chuanbo Hu
b
;
Changsheng Liu
a
;
csliu@mail.neu.edu.cn
关键词:
Electrodeposition
;
Rough structures
;
Wetting transiton
;
Superoleophobic surface
刊名:Journal of Alloys and Compounds
出版年:2017
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