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CNKI会议论文(13)
CNKI期刊论文0611(4)
万方学位论文(1)
CNKI学位论文(7088)
知网期刊论文(2162)
标准(1)
在“
Elsevier电子期刊
”中,
命中:
252
条,耗时:小于0.01 秒
在所有数据库中总计命中:
9,269
条
1.
A novel and simple method of printing
flexible
conductive
circuits
on PET fabrics
作者:
Zehong Wang
a
;
b
;
Wei Wang
a
;
b
;
Zhikang Jiang
c
;
Dan Yu
a
;
b
;
c
;
vchtian@163.com
;
yudan@dhu.edu.cn
关键词:
Conductive
;
Flexible
circuits
;
Print
;
PET fabric
刊名:Applied Surface Science
出版年:2017
2.
Medial prefrontal-perirhinal cortical communication is necessary for
flexible
response selection
作者:
Abbi R. Hernandez
a
;
Jordan E. Reasor
a
;
Leah M. Truckenbrod
a
;
Katelyn N. Lubke
a
;
b
;
Sarah A. Johnson
a
;
Jennifer L. Bizon
a
;
Andrew P. Maurer
a
;
b
;
Sara N. Burke
a
;
c
;
关键词:
Entorhinal cortex
;
Executive functions
;
Functional connectivity
;
Hippocampus
;
Memory
刊名:Neurobiology of Learning and Memory
出版年:2017
3.
Copper circuit patterning on polymer using selective surface modification and electroless plating
作者:
Sang Jin Park
a
;
Tae-Jun Ko
b
;
d
;
Juil Yoon
c
;
Myoung-Woon Moon
b
;
Kyu Hwan Oh
d
;
Jun Hyun Han
a
;
jhhan@cnu.ac.kr
关键词:
Flexible
electronics
;
Plasma treatent
;
Microstructure
;
Electroless plating
;
Cu circuit
刊名:Applied Surface Science
出版年:2017
4.
Fabrication of highly conductive graphene
flexible
circuits
by 3D printing
作者:
Di Zhang
a
;
Baihong Chi
c
;
Bowen Li
a
;
Zewen Gao
a
;
Yao Du
a
;
Jinbao Guo
a
;
Jie Wei
b
;
a
;
weij@mail.buct.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
weijie-2008@hotmail.com" class="auth_mail" title="E-mail the corresponding author
关键词:
3D print
;
Graphene
;
Flexible
circuits
刊名:Synthetic Metals
出版年:2016
5.
Mechanically
flexible
nanoscale silicon integrated
circuits
powered by photovoltaic energy harvesters
作者:
D. Shahrjerdi
a
;
davood@nyu.edu" class="auth_mail" title="E-mail the corresponding author
;
S.W. Bedell
b
;
A. Khakifirooz
c
;
K. Cheng
d
关键词:
Flexible
hybrid electronics
;
Energy harvesting
;
ETSOI technology
;
Layer transfer
刊名:Solid State Electronics
出版年:2016
6.
A facile process combined with inkjet printing, surface modification and electroless deposition to fabricate adhesion-enhanced copper patterns on
flexible
polymer substrates for functional
flexible
electronics
作者:
Yan Wang
a
;
Yu Wang
a
;
Jin-ju Chen
a
;
Hong Guo
a
;
Kun Liang
b
;
Kyle Marcus
b
;
Qi-ling Peng
c
;
Jing Zhang
a
;
Zhe-sheng Feng
a
;
fzs@uestc.edu.cn" class="auth_mail" title="E-mail the corresponding author
关键词:
flexible
electronics
;
self-assembled monolayer
;
inkjet printing
;
catalytic ink
;
electroless deposition
刊名:Electrochimica Acta
出版年:2016
7.
Design of optimal Petri-net controllers for a class of
flexible
manufacturing systems with key resources
作者:
Huixia Liu
a
;
b
;
huixialiu@126.com" class="auth_mail" title="E-mail the corresponding author
;
Weimin Wu
a
;
wmwu@iipc.zju.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
drwuweimin@gmail.com" class="auth_mail" title="E-mail the corresponding author
;
Hongye Su
a
;
hysu@iipc.zju.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Zhenxing Zhang
b
;
billzhenxing@gmail.com" class="auth_mail" title="E-mail the corresponding author
关键词:
Flexible
manufacturing system
;
Deadlock control
;
Petri net
;
Controller
刊名:Information Sciences
出版年:2016
8.
Laser-based Generation of Conductive
Circuits
on Additive Manufactured Thermoplastic Substrates
作者:
Bernd Niese
a
;
b.niese@blz.org" class="auth_mail" title="E-mail the corresponding author
;
Philipp Amend
a
;
Stephan Roth
a
;
b
;
Michael Schmidt
a
;
b
;
c
关键词:
Additive manufacturing
;
electrical conductive
circuits
;
embedding
;
silver particle ink
;
sintering by laser irradiation
刊名:Physics Procedia
出版年:2016
9.
Solution-processable CF
3
-substituted ductile polyimides with low coefficients of thermal expansion as novel coating-type protective layers in
flexible
printed circuit boards
作者:
Junichi Ishii
;
junishii@sci.toho-u.ac.jp" class="auth_mail" title="E-mail the corresponding author
;
Naoki Yokoyama
;
Masatoshi Hasegawa
关键词:
Polyimide
;
Low coefficient of thermal expansion (CTE)
;
Toughness
;
Solution processability
;
Flexible
printed circuit board (FPC)
;
Cover layer
刊名:Progress in Organic Coatings
出版年:2016
10.
Photonic Integrated
Circuits
Based on Quantum well Intermixing Techniques
作者:
Lianping Hou
;
Lianping.hou@glasgow.ac.uk" class="auth_mail" title="E-mail the corresponding author
;
John H. Marsh
关键词:
Photonic integrated
circuits
;
quantum well interxming
刊名:Procedia Engineering
出版年:2016
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