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CNKI期刊论文0611(65)
在“
Elsevier电子期刊
”中,
命中:
41,146
条,耗时:0.0379798 秒
在所有数据库中总计命中:
53,503
条
1.
Effect of surface nitridingtreatment in a steel plate on t
h
e interfacial
bonding
strengt
h
of t
h
e aluminum/steel clad s
h
eets by t
h
e cold roll
bonding
process
作者:
Bo Wu
a
;
b
;
Long Li
a
;
b
;
C
h
engdong Xia
a
;
b
;
Xiaofeng Guo
c
;
Dejing Z
h
ou
a
;
b
;
dejing.z
h
ou@cn-yinbang.com
关键词:
Al/steel clad s
h
eets
;
Nitriding treatment
;
H
ardened layer
;
Peel strengt
h
;
Cold roll
bonding
刊名:Materials Science and Engineering: A
出版年:2017
2.
Solid-liquid cast-rolling
bonding
(SLCRB) and annealing of Ti/Al cladding strip
作者:
H
.G. Huang
;
hh
g@ysu.edu.cn
;
P C
h
en
;
C Ji
关键词:
Ti/Al cladding strips
;
Solid-liquid cast-rolling
bonding
(SLCRB)
;
Bonding
interface
;
Annealing treatment
;
Compound layer
刊名:Materials & Design
出版年:2017
3.
Transient liquid p
h
ase
bonding
of γ′- precipitation strengt
h
ened Ni based superalloys for repairing gas turbine components
作者:
Jeong Kil Kim
;
jeongkil1.kim@doosan.com
;
H
ae Ji Park
;
Deog Nam S
h
im
;
Dong Jin Kim
关键词:
Bonding
;
Diffusion
;
Solidification
;
Gas turbine
刊名:Journal of Manufacturing Processes
出版年:2017
4.
Effects of active element Ti on interfacial microstructure and
bonding
strengt
h
of SiO
2
/ SiO
2
joints soldered using Sn3.5Ag4Ti(Ce,Ga) alloy filler
作者:
L.X. C
h
eng
a
;
M.R. Liu
b
;
X.Q. Wang
c
;
B.
H
. Yan
a
;
G.Y. Li
d
;
p
h
gyli@scut.edu.cn
关键词:
Intermetallics
;
Bonding
;
Interfaces
;
Fracture
刊名:Materials Science and Engineering: A
出版年:2017
5.
Microstructure c
h
aracterization and mec
h
anical be
h
avior for Ag
3
Sn joint produced by foil-based TLP
bonding
in air atmosp
h
ere
作者:
H
uakai. S
h
ao
a
;
s
h
k13@mails.tsing
h
ua.edu.cn
;
Aiping Wu
a
;
b
;
c
;
Yudian Bao
a
;
Yue Z
h
ao
a
;
c
;
Guis
h
eng Zou
a
;
c
关键词:
TLP
bonding
;
Intermetallic compounds
;
Pore
;
S
h
ear strengt
h
;
Fracture
;
Ductility
刊名:Materials Science and Engineering: A
出版年:2017
6.
Improving spectrum
h
andoff utilization for prioritized cognitive radio users by exploiting c
h
annel
bonding
wit
h
starvation mitigation
作者:
Mu
h
ammed Enes Bayrakdar
;
mu
h
ammedbayrakdar@duzce.edu.tr
;
mu
h
ammedbayrakdar@gmail.com
;
Ali Ç
;
al
h
an
alical
h
an@duzce.edu.tr
关键词:
Aging
;
C
h
annel
bonding
;
Cognitive radio networks
;
Priority
;
Spectrum
h
andoff
刊名:AEU - International Journal of Electronics and Communications
出版年:2017
7.
Mono-modal feature extraction for
bonding
quality detection of explosive clad structure wit
h
optimized dual-tree complex wavelet transform
作者:
Yue Si
;
Z
h
ousuo Z
h
ang
;
zzs@mail.xjtu.edu.cn
;
H
ongfang Wang
;
Feic
h
en Yuan
关键词:
Optimized dual-tree complex wavelet transform (ODTCWT)
;
Mono-modal feature extraction
;
Bonding
quality detection
;
Explosive clad structure
刊名:Journal of Sound and Vibration
出版年:2017
8.
Effect of Ti interlayer on t
h
e
bonding
quality of W and steel HIP joint
作者:
Ji-C
h
ao Wang
a
;
b
;
Wanjing Wang
a
;
wjwang@ipp.ac.cn
;
Ran Wei
a
;
b
;
Xingli Wang
a
;
b
;
Z
h
aoxuan Sun
a
;
b
;
C
h
unyi Xie
a
;
Qiang Li
a
;
Guang-Nan Luo
a
;
b
;
c
;
d
关键词:W ;
Steel
;
Ti
;
H
ot isostatic pressing
;
Diffusion
bonding
刊名:Journal of Nuclear Materials
出版年:2017
9.
Investigation of n-o
h
mic contact of vertical GaN-based lig
h
t-emitting diodes on grap
h
ite substrate wit
h
Ag-In
bonding
作者:
Z
h
ao Yao
a
;
b
;
H
o-Kun Sung
b
;
c
;
Nam-Young Kim
b
;
nykim@kw.ac.kr
关键词:
GaN
;
Vertical lig
h
t-emitting diodes
;
O
h
mic contact
;
Ag-In
bonding
刊名:Materials Science in Semiconductor Processing
出版年:2017
10.
Evolution of
bonding
interface in Al/Al-Mg-Si alloy clad wire during
h
eating at 500 hsp>℃
作者:
Xiang Wang
a
;
Ren-Guo Guan
a
;
b
;
15840319082@126.com" class="aut
h
_mail" title="E-mail t
h
e corresponding aut
h
or
;
Ying-Qiu S
h
ang
a
;
Wei Wang
a
;
Ning Wang
a
关键词:
H
eating
;
Interfaces
;
Grain boundaries
;
Fracture
;
Interface
bonding
strengt
h
刊名:Materials Science & Engineering A
出版年:2017
1
2
3
4
5
6
7
8
9
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