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CNKI学位论文(28)
知网期刊论文(6)
在“
Elsevier电子期刊
”中,
命中:
11
条,耗时:小于0.01 秒
在所有数据库中总计命中:
34
条
1.
The influence of ageing on the stabilisation of interfacial (Cu,Ni)
6
(Sn,Zn)
5
and (Cu,Au,Ni)
6
Sn
5
intermetallics in Pb-free Ball Grid Array (BGA) solder joints
作者:
Guang Zeng
a
;
Stuart D. McDonald
a
;
Dekui Mu
b
;
c
;
Yasuko Terada
d
;
Hideyuki Yasuda
e
;
Qinfen Gu
f
;
M.A.A. Mohd Salleh
a
;
g
;
Kazuhiro
Nogita
a
;
k.
nogita
@uq.edu.au" class="auth_mail" title="E-mail the corresponding author
关键词:
Solder
;
Synchrotron radiation
;
X-ray diffraction
;
Intermetallics
;
Phase transitions
刊名:Journal of Alloys and Compounds
出版年:2016
2.
Real time synchrotron X-ray observations of solidification in hypoeutectic Al-Si alloys
作者:
Kazuhiro
Nogita
;
Hideyuki Yasuda
;
Arvind Prasad
;
Stuart D. McDonald
;
Tomoya Nagira
;
Noriaki Nakatsuka
;
Kentaro Uesugi
;
David H. StJohn
关键词:
Solidification
;
Synchrotron X-ray imaging
刊名:Materials Characterization
出版年:2013
3.
Phase stability and thermal expansion behavior of Cu
6
Sn
5
intermetallics doped with Zn, Au and In
作者:
Guang Zeng
;
Stuart D. McDonald
;
Qinfen Gu
;
Shoichi Suenaga
;
Yong Zhang
;
Jianghua Chen
;
Kazuhiro
Nogita
关键词:
A. Intermetallics
;
miscellaneous
;
B. Phase transformation
;
E. Ab-initio calculations
;
F. Diffraction
刊名:Intermetallics
出版年:2013
4.
Growth orientations and mechanical properties of Cu
6
Sn
5
and (Cu,Ni)
6
Sn
5
on poly-crystalline Cu
作者:
Dekui Mu
;
Hideyuki Yasuda
;
Han Huang
;
Kazuhiro
Nogita
关键词:
Growth orientation
;
Pole figures
;
Synchrotron radiation
;
Mechanical properties
;
Nanoindentation
;
Intermetallics
;
Crystal growth
;
X-ray diffraction
刊名:Journal of Alloys and Compounds
出版年:2012
5.
Development of high-temperature solders: Review
作者:
Guang Zeng
;
g.zeng@uq.edu.au
;
Stuart McDonald
;
Kazuhiro
Nogita
刊名:Microelectronics Reliability
出版年:2012
6.
Stabilisation of Cu
6
Sn
5
by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys
作者:
Kazuhiro
Nogita
关键词:
A. Intermetallics
;
miscellaneous
;
B. Phase transformation
;
C. Joining
;
D. Microstructure
;
F. Microscopy
;
various
刊名:Intermetallics
出版年:2010
7.
Epitaxial growth of Cu
6
Sn
5
formed at Sn-based lead-free solder/non-textured polycrystalline Cu plate interface
作者:
Hideaki Tsukamoto
;
Tetsuro Nishimura
;
Kazuhiro
Nogita
关键词:
Intermetallic compound (IMC)
;
Crystal growth
;
Lead-free solder
;
X-ray diffraction (XRD)
刊名:Materials Letters
出版年:2009
8.
Nanoindentation characterization of intermetallic compounds formed between Sn–Cu (–Ni) ball grid arrays and Cu substrates
作者:
Hideaki Tsukamoto
;
Zhigang Dong
;
Han Huang
;
Tetsuro Nishimura
;
Kazuhiro
Nogita
关键词:
Nanoindentation
;
Mechanical property
;
Intermetallic compound
;
Lead-free solder
刊名:Materials Science and Engineering: B
出版年:2009
9.
Nickel-stabilized hexagonal (Cu, Ni)
6
Sn
5
in Sn–Cu–Ni lead-free solder alloys
作者:
Kazuhiro
Nogita
;
Tetsuro Nishimura
关键词:
Intermetallic compound
;
Solder
;
Transmission electron microscopy
;
Phase transformation
刊名:Scripta Materialia
出版年:2008
10.
Eutectic grain size and strontium concentration in hypoeutectic aluminium–silicon alloys
作者:
Stuart D. McDonald
;
Kazuhiro
Nogita
and Arne K. Dahle
关键词:
Metals and alloys
;
Liquid–
;
solid reactions
;
Microstructure
;
Thermal analysis
刊名:Journal of Alloys and Compounds
出版年:2006
1
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