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CNKI会议论文(1)
CNKI学位论文(932)
CNKI期刊论文0611(1)
知网期刊论文(323)
在“
Elsevier电子期刊
”中,
命中:
133
条,耗时:0.0699633 秒
在所有数据库中总计命中:
1,257
条
1.
Study of the two-phase dummy load shut-down strategy for proton exchange membrane fuel cells
作者:
Q. Zhang
a
;
b
;
c
;
R. Lin
a
;
b
;
c
;
ruilin@tongji.edu.cn
;
X. Cui
a
;
b
;
c
;
S.X. Xia
a
;
b
;
c
;
Z. Yang
c
;
Y.T. Chang
c
关键词:
PEMFC
;
Dummy load
;
Shut-down strategy
;
Printed
circuit
board
technique
刊名:Journal of Power Sources
出版年:2017
2.
On-chip Feedthrough Cancellation
Technique
for Enhanced Electrical Characterization of a Piezoelectric MEMS Resonator in Water
作者:
Abid Ali
a
;
abidali2-c@my.cityu.edu.hk
;
Joshua E.-Y. Lee
a
;
b
关键词:
AlN-on-silicon
;
MEMS resonator
;
Feedthrough cancellation
;
Quality factor
;
Differential inputs
刊名:Procedia Engineering
出版年:2016
3.
Theory and
circuit
modeling of baseband and modulated signal delay compensations with low- and band-pass NGD effects
作者:
B. Ravelo
a
;
blaise.ravelo@esigelec.fr" class="auth_mail" title="E-mail the corresponding author
;
S. Lallé
;
chè
;
re
b
;
sebastien.lallechere@lasmea.univ-bpclermont.fr" class="auth_mail" title="E-mail the corresponding author
;
A. Thakur
c
;
atulthakur@shooliniuniversity.com" class="auth_mail" title="E-mail the corresponding author
;
A. Saini
c
;
kushrana88@gmail.com" class="auth_mail" title="E-mail the corresponding author
;
P. Thakur
c
;
preetithakur@shooliniuniversity.com" class="auth_mail" title="E-mail the corresponding author
关键词:
Delay reduction
;
Electrical interconnect
;
Correction
technique
;
Negative group delay (NGD)
;
RF signal
;
Low-pass/band-pass NGD cell
刊名:AEU - International Journal of Electronics and Communications
出版年:2016
4.
Biomedical microfluidic devices by using low-cost fabrication
technique
s: A review
作者:
Vera Faustino
a
;
c
;
vera_f_87@hotmail.com" class="auth_mail" title="E-mail the corresponding author
;
Susana O. Catarino
a
;
c
;
scatarino@dei.uminho.pt" class="auth_mail" title="E-mail the corresponding author
;
Rui Lima
b
;
c
;
d
;
rl@dem.uminho.pt" class="auth_mail" title="E-mail the corresponding author
;
Graç
;
a Minas
a
;
gminas@dei.uminho.pt" class="auth_mail" title="E-mail the corresponding author
关键词:
Low-cost
;
Biomedical microdevices
;
Biomicrofluidics
;
Soft lithography
;
Nonlithographic
technique
刊名:Journal of Biomechanics
出版年:2016
5.
Quantification of the natural convective heat transfer for the tilted and wire-bonded QFN32b-PCB electronic assembly
作者:
A. Baï
;
ri
abairi@u-paris10.fr" class="auth_mail" title="E-mail the corresponding author
bairi.a@gmail.com" class="auth_mail" title="E-mail the corresponding author
关键词:
Natural convection
;
Thermal control
;
Electronics
;
Wire-bonding
technique
;
Quad flat non-lead
;
QFN32b
;
Packaging
;
Convective heat transfer coefficient
;
Engineering applications
刊名:International Communications in Heat and Mass Transfer
出版年:2016
6.
Activated carbon derived from non-metallic
printed
circuit
board
waste for supercapacitor application
作者:
Raghu Raman Rajagopal
a
;
L.S. Aravinda
b
;
Ravindra Rajarao
a
;
r.rajarao@unsw.edu.au" class="auth_mail" title="E-mail the corresponding author
;
Badekai Ramachandra Bhat
b
;
Veena Sahajwalla
a
关键词:
Electronic waste
;
Waste PCBs
;
Activated carbon
;
Supercapacitors
刊名:Electrochimica Acta
出版年:2016
7.
Experimental and Numerical Study of Natural Convection for High Powered and Wire-Bonded QFN64b Electronic Device
作者:
A. Baï
;
ri
;
abairi@u-paris10.fr" class="auth_mail" title="E-mail the corresponding author
;
bairi.a@gmail.com" class="auth_mail" title="E-mail the corresponding author
;
J.-G. Bauzin
;
N. Alilat
关键词:
Electronics
;
Thermal control
;
Natural convection
;
High powered QFN64b
;
Wire-bonding
technique
;
Electronic packaging
;
Convective heat transfer coefficient
;
Correlations
刊名:International Communications in Heat and Mass Transfer
出版年:2016
8.
Free convective heat transfer for the wire-bonded and low powered QFN64b electronic device
作者:
A. Baï
;
ri
关键词:
Electronics
;
Thermal control
;
Natural convection
;
Low powered QFN64b
;
Wire-bonding
technique
;
Electronic packaging
;
Convective heat transfer coefficient
;
Correlations
刊名:International Communications in Heat and Mass Transfer
出版年:2016
9.
An Artificial Panel Produced by Sorting Residue of Copper Clad Laminate
作者:
Yanzhi Chen
a
;
Wei Wang
a
;
wangwei@scies.org" class="auth_mail" title="E-mail the corresponding author
;
Mingfeng Zhong
b
;
Yong Wen
a
;
Xiaowen Liu
a
关键词:
sorting residue of copper clad laminate
;
artificial panel
;
resin
;
mechanical properties
刊名:Procedia Environmental Sciences
出版年:2016
10.
Enhanced pressureless bonding by Tin Doped Silver Paste at low sintering temperature
作者:
Cheng-Xiang Yang
a
;
b
;
Xin Li
a
;
xinli@tju.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Guo-Quan Lu
a
;
b
;
Yun-Hui Mei
a
关键词:
Transient liquid phase sintering
;
Silver paste
;
Pressureless bonding
;
Second-phase strengthening
;
Solid solution strengthening
刊名:Materials Science & Engineering A
出版年:2016
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