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内部出版物
在“
Elsevier电子期刊
”中,
命中:
1,149
条,耗时:小于0.01 秒
1.
Effects of Ni and TiO
2
additions in as-
reflow
ed and annealed Sn0.7Cu solders on Cu substrates
作者:
M.A.A. Mohd Salleh
a
;
b
;
arifanuar@unimap.edu.my
;
S.D. McDonald
a
;
K. Nogita
a
关键词:
Lead-free solder
;
Reflow
soldering
;
Microstructure
;
Intermetallic
;
Interfacial reaction
;
Shear strength
刊名:Journal of Materials Processing Technology
出版年:2017
2.
Reduction of capacity decay in vanadium flow batteries by an electrolyte-
reflow
method
作者:
Ke Wang
a
;
Le Liu
a
;
liu.le@sz.tsinghua.edu.cn
;
Jingyu Xi
a
;
Zenghua Wu
a
;
Xinping Qiu
a
;
b
关键词:
Vanadium flow battery
;
Electrolyte
;
Reflow
;
Capacity decay
;
Cycle life
;
Rebalance
刊名:Journal of Power Sources
出版年:2017
3.
Real time joint resistance monitoring during solder
reflow
作者:
Di Erick Xu
;
d9xu@uwaterloo.ca
;
Michael David Hook
;
Michael Mayer
关键词:
Solder
reflow
;
Real time resistance monitoring
;
Transient opening
;
Flux activation
刊名:Journal of Alloys and Compounds
出版年:2017
4.
Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted
reflow
soldering
作者:
Ai Ting Tan
aiting2602@gmail.com" class="auth_mail" title="E-mail the corresponding author
;
Ai Wen Tan
aiwen_2101@hotmail.com" class="auth_mail" title="E-mail the corresponding author
;
Farazila Yusof
;
farazila@um.edu.my" class="auth_mail" title="E-mail the corresponding author
关键词:
Ultrasonic soldering
;
Vibration time
;
Reflow
;
Lead-free
;
Microstructure
;
Mechanical properties
刊名:Ultrasonics Sonochemistry
出版年:2017
5.
Shear strength and fracture behavior of
reflow
ed Sn3.0Ag0.5Cu/Cu solder joints under various strain rates
作者:
Xiaowu Hu
a
;
b
;
Tao Xu
a
;
Leon M. Keer
c
;
Yulong Li
a
;
liyulong@ncu.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Xiongxin Jiang
a
关键词:
Shear strength
;
Fracture behavior
;
Lead-free solder
;
Strain rate
刊名:Journal of Alloys and Compounds
出版年:2017
6.
Predictors and outcome of no-
reflow
post primary percutaneous coronary intervention for ST elevation myocardial infarction
作者:
Jawad Mazhar
a
;
1
;
jawadmc2@gmail.com" class="auth_mail" title="E-mail the corresponding author
;
Mary Mashicharan
a
;
1
;
Ahmad Farshid
a
;
b
;
1
关键词:
No-
reflow
;
Slow coronary flow
;
Primary percutaneous coronary intervention
;
ST elevation myocardial infarction
刊名:IJC Heart & Vasculature
出版年:2016
7.
The no-
reflow
phenomenon in the young and in the elderly
作者:
Edina Cenko
a
;
Beatrice Ricci
a
;
Sasko Kedev
b
;
Oliver Kalpak
b
;
Lucian Câ
;
lmâ
;
c
c
;
Zorana Vasiljevic
d
;
Božidarka Knežević
e
;
Mirza Dilic
f
;
Davor Miličić
g
;
Olivia Manfrini
a
;
Akos Koller
h
;
Maria Dorobantu
c
;
i
;
Lina Badimon
j
;
Raffaele Bugiardini
a
;
raffaele.bugiardini@unibo.it" class="auth_mail" title="E-mail the corresponding author
关键词:
No-
reflow
;
Acute coronary syndromes
;
Mortality
;
Therapy
;
Percutaneous coronary intervention
刊名:International Journal of Cardiology
出版年:2016
8.
Effects of liraglutide on no-
reflow
in patients with acute ST-segment elevation myocardial infarction
作者:
Wei Ren Chen
1
;
Feng Tian
1
;
Yun Dai Chen
;
cyundai@vip.163.com" class="auth_mail" title="E-mail the corresponding author
;
Jing Wang
;
Jun Jie Yang
;
Zhi Feng Wang
;
Jin Da Wang
;
Qing Xiu Ning
关键词:
Glucagon-like peptide-1
;
No-
reflow
;
Acute ST-segment elevation myocardial infarction
;
Reperfusion injury
;
Percutaneous coronary intervention
刊名:International Journal of Cardiology
出版年:2016
9.
Association of endothelial dysfunction and no-
reflow
during primary percutaneous coronary intervention for ST-elevation myocardial infarction
作者:
Yaniv Levi
a
;
b
;
Ayyaz Sultan
a
;
b
;
Mistre Alemayehu
b
;
Sabrina Wall
b
;
Shahar Lavi
a
;
b
;
Shahar.Lavi@lhsc.on.ca
关键词:
Angiography
;
Acute MI
;
No-
reflow
刊名:Cardiovascular Revascularization Medicine
出版年:2016
10.
Recrystallization induced by subgrain rotation in Pb-free BGA solder joints under thermomechanical stress
作者:
J. Han
;
hanjing@bjut.edu.cn
;
F. Guo
;
J.P. Liu
关键词:
Recrystallization
;
Subgrain rotation
;
Grain orientation evolution
;
Pb-free BGA solder joints
;
EBSD
刊名:Journal of Alloys and Compounds
出版年:2017
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