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在“Elsevier电子期刊”中，命中：70条，耗时：0.0169903 秒

在所有数据库中总计命中：318条

1.Temporal and frequency characteristic analysis of margin-related failures caused by an intermittent nano-scale fracture of the solder ball in a BGA package device

作者：Hosung Lee ; Sanghyeon Baeg ; ^{bau@hanyang.ac.kr} ; Nelson Hua ; ShiJie Wen

关键词：Solder ball defect ; Solder ball fracture ; Intermittent failure ; Ball grid array package device ; AC-coupling ; Frequency characteristic

刊名：Microelectronics Reliability

出版年：2017

2.Interfacial reaction, ball shear strength and fracture surface analysis of lead-free solder joints prepared using cobalt nanoparticle doped flux

作者：G.K. Sujan^a ; ^{sgkumer@gmail.com} ; A.S.M.A. Haseeb^a ; ^{haseeb@um.edu.my} ; Hiroshi Nishikawa^b ; ^{nisikawa@jwri.osaka-u.ac.jp} ; M.A. Amalina^a ; ^{amalina@um.edu.my}

关键词：SAC solder alloy ; Microstructure ; Intermetallic compound ; Mechanical property

刊名：Journal of Alloys and Compounds

出版年：2017

3.Reinforcing cross-tension strength of adhesively bonded joints using metallic solder balls

作者：XiaoBo Zhu^a ; ^b ; Xin Yang^c ; YongBing Li^a ; ^b ; ^{yongbinglee@sjtu.edu.cn" class="auth_mail" title="E-mail the corresponding author} ; Blair E. Carlson^d

关键词：Epoxy/epoxides ; Steels ; Peel/cross-tension ; Fracture ; Solder balls

刊名：International Journal of Adhesion and Adhesives

出版年：2016

4.Effect of CNTs and Ni coated CNTs on the mechanical performance of Sn57.6Bi0.4Ag BGA solder joints

作者：Huayu Sun^a ; ^{huayusun22@gmail.com" class="auth_mail" title="E-mail the corresponding author} ; Y.C. Chan^a ; Fengshun Wu^b

关键词：Sn57.6Bi0.4Ag solder alloy ; Carbon nanotube ; Ni coating ; Dispersing ; Mechanical performance

刊名：Materials Science & Engineering A

出版年：2016

5.Experimental investigation of the failure mechanism of Cu-Sn intermetallic compounds in SAC solder joints

作者：Chaoran Yang ; Fuliang Le ; S.W. Ricky Lee ; ^{rickylee@ust.hk" class="auth_mail" title="E-mail the corresponding author}

关键词：Cu&ndash ; Sn IMCs ; Brittle failure ; Fractographic analysis ; Charpy impact test ; Cu3Sn-controlling thermal degradation mechanism

刊名：Microelectronics Reliability

出版年：2016

6.Effect of adhesive fillet geometry on bond strength between microelectronic components and composite circuit boards

作者：Saeed Akbari ; Amir Nourani ; Jan K. Spelt ; ^{spelt@mie.utoronto.ca" class="auth_mail" title="E-mail the corresponding author}

关键词：A. Polymer-matrix composites (PMCs) ; B. Adhesion ; C. Finite element analysis (FEA) ; D. Failure

刊名：Composites Part A: Applied Science and Manufacturing

出版年：2016

7.Evaluation of mechanical properties of low-Ag ball grid array solder joints using a high-speed ball shear test

作者：Q.V. Bui ; S.B. Jung

关键词：Pb-free solder ; High-speed shear test ; Electroless nickel/electroless palladium/immersion gold ; Intermetallic compound

刊名：Journal of Alloys and Compounds

出版年：15 March, 2014

8.Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn-Cu-Ni (SCN) lead-free solder joints

作者：Chaoran Yang ; Fubin Song ; S.W. Ricky Lee

刊名：Microelectronics Reliability

出版年：February, 2014

9.Structural characterization and creep resistance of nano-silicon carbide reinforced Sn-1.0Ag-0.5Cu lead-free solder alloy

作者：A.A. El-Daly ; G.S. Al-Ganainy ; A. Fawzy ; M.J. Younis

关键词：Lead-free solder ; Microstructure ; Mechanical properties

刊名：Materials and Design

出版年：March, 2014

10.Effects of nano-Al₂O₃ particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads

作者：L.C. Tsao^a ; ^{tlclung@mail.npust.edu.tw} ; R.W. Wu^b ; Te-Hsien Cheng^a ; Kuo-Huan Fan^a ; R.S. Chen^b

关键词：A. Non-ferros metals and alloys ; D. Brazing and soldering ; F. Microstructure

刊名：Materials and Design

出版年：2013

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