设为首页
收藏本站
网站地图
|
English
|
公务邮箱
About the library
Background
History
Leadership
Organization
Readers' Guide
Opening Hours
Collections
Help Via Email
Publications
Electronic Information Resources
常用资源
电子图书
期刊论文
学位会议
外文资源
特色专题
内部出版物
CNKI学位论文(105)
CNKI期刊论文0611(1)
知网期刊论文(226)
在“
Elsevier电子期刊
”中,
命中:
42
条,耗时:小于0.01 秒
在所有数据库中总计命中:
332
条
1.
Effects of magnetic field distributions on
wire
sawing
performance
作者:
Wei Zhang
;
Xuefeng Xu
;
Tengwei Qiu
;
Chunyan Yao
;
ycy@zjut.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Wei Peng
关键词:
Free-abrasive
wire
sawing
;
Magnetic abrasive grains
;
Magnetic field
;
Wire
sawing
performance
刊名:Precision Engineering
出版年:2017
2.
Subsurface crack damage in silicon wafers induced by resin bonded diamond
wire
sawing
作者:
Tengyun Liu
a
;
lty198614@163.com" class="auth_mail" title="E-mail the corresponding author
;
Peiqi Ge
a
;
b
;
pqge@sdu.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Wenbo Bi
a
;
b
;
biwenbo@sdu.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Yufei Gao
a
;
b
;
yfgao@sdu.edu.cn" class="auth_mail" title="E-mail the corresponding author
关键词:
Resin bonded diamond
wire
saw
;
Silicon wafer
;
Subsurface crack damage
刊名:Materials Science in Semiconductor Processing
出版年:2017
3.
Wire
sawing
technology: A state-of-the-art review
作者:
Hao Wu
;
pingchina85@gmail.com" class="auth_mail" title="E-mail the corresponding author
关键词:
Wire
sawing
;
Diamond
wire
sawing
;
Modeling
;
Material removal
;
Indentation
;
Scribing
刊名:Precision Engineering
出版年:2016
4.
Source of boron and phosphorus impurities in the silicon
wiresawing
slurry and their removal by acid leaching
作者:
Suning Liu
;
Kai Huang
;
khuang@metall.ustb.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Hongmin Zhu
;
hzhu@metall.ustb.edu.cn" class="auth_mail" title="E-mail the corresponding author
关键词:
Silicon
wiresawing
slurry
;
Boron and phosphorus
;
Source
;
Recovery
;
Acid leaching
刊名:Separation and Purification Technology
出版年:2017
5.
Investigations on the trajectories of magnetic abrasive grains in magnetic induction-free abrasive
wire
sawing
作者:
Wei Zhang
;
Chunyan Yao
;
ycy@zjut.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Chen Tang
;
Tengwei Qiu
;
Xuefeng Xu
关键词:
Free abrasive
wire
sawing
;
High gradient magnetic field
;
Paramagnetic region
;
Diamagnetic region
;
Trajectory
刊名:Journal of Magnetism and Magnetic Materials
出版年:2016
6.
Cu-contamination of single crystalline silicon wafers with thickness of 100 μm during multi-
wire
sawing
process
作者:
Sunho Choi
a
;
Boyun Jang
a
;
byjang@kier.re.kr" class="auth_mail" title="E-mail the corresponding author
;
Joonsoo Kim
a
;
Heeeun Song
a
;
Moonhee Han
b
;
关键词:
Cu-contamination
;
Slurry
;
Multi-
wire
sawing
;
Wafer
刊名:Solar Energy
出版年:2016
7.
Effect of
sawing
induced micro-crack orientations on fracture properties of silicon wafers
作者:
Amin S. Azar
a
;
amin.azar@sintef.no" class="auth_mail" title="E-mail the corresponding author
;
Bø
;
rge Holme
a
;
Ø
;
yvind Nielsen
b
关键词:
Abrasive
wire
sawing
;
Silicon
;
Wafer
;
Subsurface cracks
;
Fracture mechanics
刊名:Engineering Fracture Mechanics
出版年:2016
8.
Effect of wear of diamond
wire
on surface morphology, roughness and subsurface damage of silicon wafers
作者:
Arkadeep Kumar
a
;
arkadeepkumar@gatech.edu" class="auth_mail" title="E-mail the corresponding author
;
Steffi Kaminski
b
;
Shreyes N. Melkote
a
;
Chris Arcona
b
关键词:
Wear
;
Diamond
;
Wire
sawing
;
Silicon wafer
;
Surface
;
Subsurface damage
刊名:Wear
出版年:2016
9.
Effect of Diamond
Wire
Saw Marks on Solar Cell Performance
作者:
Hubert Seigneur
a
;
b
;
c
;
Hubert.Seigneur@uspvmc.org" class="auth_mail" title="E-mail the corresponding author
;
Eric J. Schneller
a
;
b
;
Narendra S. Shiradkar
a
;
d
;
Winston V. Schoenfeld
a
;
b
;
c
关键词:
Silicon solar cell
;
Diamond
wire
saw
;
Ingot
;
Photoluminescence
;
Quantum efficiency
;
Spatially resolved loss analysis
刊名:Energy Procedia
出版年:2016
10.
Removal of Fe, B and P impurities by enhanced separation technique from silicon-rich powder of the multi-
wire
sawing
slurry
作者:
Suning Liu
;
Kai Huang
;
khuang@metall.ustb.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Hongmin Zhu
关键词:
Wiresawing
slurry
;
Silicon-rich powder
;
Pre-dispersion
;
Magnetic separation
;
Microwave acid leaching
刊名:Chemical Engineering Journal
出版年:2016
1
2
3
4
5
按检索点细分(42)
题名(18)
关键词(19)
文摘(38)
按出版年细分(42)
2027年及以后(3)
2017年(3)
2016年(8)
2015年(1)
2013年(6)
2012年(4)
2011年(5)
2009年(1)
2008年(1)
2007年(1)
2006年(2)
2005年(1)
2004年(2)
2003年(1)
2002年(2)
2000年及以前(1)
NGLC 2004-2010.National Geological Library of China All Rights Reserved.
Add:29 Xueyuan Rd,Haidian District,Beijing,PRC. Mail Add: 8324 mailbox 100083
For exchange or info please contact us via
email
.