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馆藏期刊(1)	Springer电子图书(1)	CNKI学位论文(429)	知网期刊论文(724)
馆藏书目(1)	CNKI会议论文(2)	CNKI期刊论文0611(3)	万方学位论文(1)

在“Elsevier电子期刊”中，命中：195条，耗时：小于0.01 秒

在所有数据库中总计命中：1,162条

1.Clinical effects of pre-transplant serum 25-hydroxyvitamin D level on post-transplant immunologic and non-immunologic outcomes in kidney transplant recipients

作者：Tae Hyun Ban^a ; ^b ; Jeong Ho Kim^a ; ^b ; Han Beol Jang^a ; Yoon Seo Lee^a ; Bum Soon Choi^a ; ^b ; Cheol Whee Park^a ; ^b ; Chul Woo Yang^a ; ^b ; Yong-Soo Kim^a ; ^b ; Byung Ha Chung^a ; ^b ; ^{chungbh@catholic.ac.kr}

关键词：25(OH)D ; 25-hydroxyvitamin D ; KTRs ; kidney transplant recipients ; BPAR ; biopsy-proven acute rejection ; BMD ; bone mineral density

刊名：Transplant Immunology

出版年：2017

2.Doping of graphene for the application in nano-interconnect

作者：Xiangyu Wu^a ; ^b ; ^{xiangyu.wu@imec.be} ; Inge Asselberghs^b ; Maria Politou^a ; ^b ; Antonino Contino^a ; ^b ; Iuliana Radu^b ; Cedric Huyghebaert^b ; Zsolt Tokei^b ; Bart Soree^a ; ^b ; Stefan De Gendt^a ; ^b ; Steven De Feyter^a ; Marc Heyns^a ; ^b

关键词：Graphene ; Nano-interconnects ; Doping ; Mobility ; Sheet resistance

刊名：Microelectronic Engineering

出版年：2017

3.Dielectrics stability for intermediate BEOL in 3D sequential integration

刊名：Microelectronic Engineering

出版年：2017

4.Mixed-mode cohesive zone parameters for sub-micron scale stacked layers to predict microelectronic device reliability

作者：Sathyanarayanan Raghavan^a ; ^{sathya@gatech.edu" class="auth_mail" title="E-mail the corresponding author} ; Ilko Schmadlak^b ; George Leal^c ; Suresh K. Sitaraman^a

关键词：Cohesive zone modeling ; Microelectronic package reliability ; BEOL stack fracture ; ULK cracking

刊名：Engineering Fracture Mechanics

出版年：2016

5.Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line

作者：Luka Ključar^a ; ^b ; ^{luka.kljucar@imec.be" class="auth_mail" title="E-mail the corresponding author} ; Mario Gonzá ; lez^a ; Ingrid De Wolf^a ; ^b ; Kristof Croes^a ; Jü ; rgen Bö ; mmels^a ; Zsolt Tőkei^a

关键词：Design evaluation ; BEOL via density ; Low-k Young's modulus ; Design/attribute/metric space ; Shannon entropy ; Saaty method ; Membership grade ; Distance norms ; Response surface

刊名：Microelectronics Reliability

出版年：2016

6.Advanced thermal simulation of SiGe:C HBTs including back-end-of-line

作者：Vincenzo d'Alessandro^a ; ^{vindales@unina.it} ; Alessandro Magnani^a ; Lorenzo Codecasa^b ; Niccolò ; Rinaldi^a ; Klaus Aufinger^c

关键词：Back-end-of-line (BEOL) ; Finite element method (FEM) ; Heterojunction bipolar transistor (HBT) ; Self-heating (SH) ; Silicon germanium (SiGe) ; Thermal resistance

刊名：Microelectronics Reliability

出版年：2016

7.Stress-induced trench narrowing in Cu interconnect of sub-20 nm node: FEM simulation

作者：Dong-Hyun Kim^a ; ^{dhkim0235@gmail.com" class="auth_mail" title="E-mail the corresponding author} ; ^{dh0131.kim@samsung.com" class="auth_mail" title="E-mail the corresponding author} ; Sung-Wook Mhin^b ; Myung-Hwan Byun^c ; ^{myunghbyun@kmu.ac.kr" class="auth_mail" title="E-mail the corresponding author}

关键词：BEOL ; Trench ; Failure ; Mechanical stress ; FEM

刊名：Materials Science in Semiconductor Processing

出版年：2016

8.Effects of BEOL on self-heating and thermal coupling in SiGe multi-finger HBTs under real operating condition

作者：A.D.D. Dwivedi^a ; ^{arun-dev-dhar.dwivedi@ims-bordeaux.fr" class="auth_mail" title="E-mail the corresponding author} ; ^{adddwivedi@gmail.com" class="auth_mail" title="E-mail the corresponding author} ; Anjan Chakravorty^b ; ^{anjan@ee.iitm.ac.in" class="auth_mail" title="E-mail the corresponding author} ; Rosario D&rsquo ; Esposito^a ; ^{rosario.desposito@ims-bordeaux.fr" class="auth_mail" title="E-mail the corresponding author} ; Amit Kumar Sahoo^a ; ^{amit7phy@gmail.com" class="auth_mail" title="E-mail the corresponding author} ; Sebastien Fregonese^a ; ^{sebastien.fregonese@ims-bordeaux.fr" class="auth_mail" title="E-mail the corresponding author} ; Thomas Zimmer^a ; ^{thomas.zimmer@ims-bordeaux.fr" class="auth_mail" title="E-mail the corresponding author}

关键词：SiGe ; Multi-finger HBT ; TCAD ; Self-heating ; Thermal coupling ; Compact model

刊名：Solid State Electronics

出版年：2016

9.Impact of HF-based cleaning solutions on via resistance for sub-10 nm BEOL structures

作者：B. Peethala^a ; ^{peethala@us.ibm.com" class="auth_mail" title="E-mail the corresponding author} ; F.W. Mont^b ; S. Molis^c ; R. Knarr^d ; B. L'lherron^e ; C. Labelle^b ; D. Canaperi^a ; S. Siddiqui^b ; ^{Shariq.Siddiqui@globalfoundries.com" class="auth_mail" title="E-mail the corresponding author}

关键词：Multiple patterning ; Via interface ; Cu surface cleaning ; Ultra-dilute HF solutions

刊名：Microelectronic Engineering

出版年：2016

10.Band diagram for low-k/Cu interconnects: The starting point for understanding back-end-of-line (BEOL) electrical reliability

作者：Michael J. Mutch^a ; Thomas Pomorski^a ; Brad C. Bittel^a ; ^b ; Corey J. Cochrane^c ; Patrick M. Lenahan^a ; ^c ; ^{pmlesm@engr.psu.edu" class="auth_mail" title="E-mail the corresponding author} ; Xin Liu^d ; Robert J. Nemanich^d ; Justin Brockman^e ; Marc French^e ; Markus Kuhn^e ; Benjamin French^f ; Sean W. King^e ; ^{sean.king@intel.com" class="auth_mail" title="E-mail the corresponding author}

关键词：Low-k ; Interconnect ; Band diagram ; XPS ; EPR ; Magnetic resonance

刊名：Microelectronics Reliability

出版年：2016

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