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CNKI期刊论文0611(5)
标准(2)
在“
Elsevier电子期刊
”中,
命中:
214
条,耗时:0.0109661 秒
在所有数据库中总计命中:
3,452
条
1.
A method to optimize the
diamond
wire
cutting process
作者:
S. Turchetta
;
turchetta@unicas.it
;
L. Sorrentino
;
C. Bellini
关键词:
Diamond
wire
;
Cutting force
;
Bead wear
;
Stone machining
;
Process optimization
刊名:
Diamond
and Related Materials
出版年:2017
2.
Subsurface crack damage in silicon wafers induced by resin bonded
diamond
wire
sawing
作者:
Tengyun Liu
a
;
lty198614@163.com" class="auth_mail" title="E-mail the corresponding author
;
Peiqi Ge
a
;
b
;
pqge@sdu.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Wenbo Bi
a
;
b
;
biwenbo@sdu.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Yufei Gao
a
;
b
;
yfgao@sdu.edu.cn" class="auth_mail" title="E-mail the corresponding author
关键词:
Resin bonded
diamond
wire
saw
;
Silicon wafer
;
Subsurface crack damage
刊名:Materials Science in Semiconductor Processing
出版年:2017
3.
Experiment study on electroplated
diamond
wire
saw slicing single-crystal silicon
作者:
Yufei Gao
;
yfgao@sdu.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Peiqi Ge
;
Tengyun Liu
关键词:
Electroplated
diamond
wire
;
Wire
saw machining
;
Single-crystal silicon
;
Wafer slicing
;
Wafer quality
刊名:Materials Science in Semiconductor Processing
出版年:2016
4.
Effect of
Diamond
Wire
Saw Marks on Solar Cell Performance
作者:
Hubert Seigneur
a
;
b
;
c
;
Hubert.Seigneur@uspvmc.org" class="auth_mail" title="E-mail the corresponding author
;
Eric J. Schneller
a
;
b
;
Narendra S. Shiradkar
a
;
d
;
Winston V. Schoenfeld
a
;
b
;
c
关键词:
Silicon solar cell
;
Diamond
wire
saw
;
Ingot
;
Photoluminescence
;
Quantum efficiency
;
Spatially resolved loss analysis
刊名:Energy Procedia
出版年:2016
5.
Development of a novel micro w-EDM power source with a multiple Resistor-Capacitor (mRC) relaxation circuit for machining high-melting point, -hardness and -resistance materials
作者:
Shun-Tong Chen
;
chenst@ntnu.edu.tw" class="auth_mail" title="E-mail the corresponding author
;
chenst@ntu.edu.tw" class="auth_mail" title="E-mail the corresponding author
(Professor)
;
Chi-Hung Chen (Graduate student)
关键词:
Multiple Resistor-Capacitor (mRC)
;
Spark erosion rate (SER)
;
Electro-thermal machinability (ETM)
;
Cutting performance (CP)
;
High-melting point
;
-hardness and -resistance materials
刊名:Journal of Materials Processing Technology
出版年:2017
6.
The Prediction of Surface Finish and Cutting Speed for
Wire
Electro-discharge Machining of Polycrystalline
Diamond
作者:
M. Galindo-Fernandez
a
;
C. Diver
b
;
carl.diver@manchester.ac.uk" class="auth_mail" title="E-mail the corresponding author
;
W. Leahy
c
关键词:
Wire
electro-dischare machining
;
Pollycrystalline
Diamond
;
Surface roughness
;
Cutting Speed
;
Taguchi Method
刊名:Procedia CIRP
出版年:2016
7.
On the mechanism of the vapor etching of
diamond
wire
sawn multi-crystalline silicon wafers for texturing
作者:
Zhigang Xiao
;
Guoying Geng
;
Xiuqin Wei
;
Zhihao Yue
;
Lang Zhou
;
lzhou@ncu.edu.cn" class="auth_mail" title="E-mail the corresponding author
关键词:
Vapor etching
;
Texturization
;
Diamond
wire
saw
;
Multi-crystalline silicon wafer
刊名:Materials Science in Semiconductor Processing
出版年:2016
8.
Effect of wear of
diamond
wire
on surface morphology, roughness and subsurface damage of silicon wafers
作者:
Arkadeep Kumar
a
;
arkadeepkumar@gatech.edu" class="auth_mail" title="E-mail the corresponding author
;
Steffi Kaminski
b
;
Shreyes N. Melkote
a
;
Chris Arcona
b
关键词:
Wear
;
Diamond
;
Wire
sawing
;
Silicon wafer
;
Surface
;
Subsurface damage
刊名:Wear
出版年:2016
9.
Study on nano-pores enlargement during Ag-assisted electroless etching of
diamond
wire
sawn polycrystalline silicon wafers
作者:
Yu-Chao Niu
a
;
b
;
niuyuchao@sdjzu.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Hsing-Tsun Liu
c
;
Xiang-Ju Liu
a
;
Yan-Sen Jiang
c
;
Xian-Kun Ren
c
;
Pei Cai
d
;
Tong-Guang Zhai
a
;
d
关键词:
Silicon solar cell
;
Diamond
wire
sawn wafer
;
Ag-assisted electroless etching
;
Texture
;
Nano-structure
刊名:Materials Science in Semiconductor Processing
出版年:2016
10.
Versatile strategies for improving the performance of
diamond
wire
sawn mc-Si solar cells
作者:
Y.F. Zhuang
a
;
S.H. Zhong
a
;
Z.G. Huang
a
;
b
;
W.Z. Shen
a
;
c
;
wzshen@sjtu.edu.cn" class="auth_mail" title="E-mail the corresponding author
关键词:
Solar cell
;
Diamond
wire
sawn
;
Multicrystalline silicon
;
Metal-catalyzed chemical etching
;
Nano/micro-texture
刊名:Solar Energy Materials and Solar Cells
出版年:2016
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