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CNKI会议论文(1)
CNKI学位论文(144)
知网期刊论文(59)
在“
Elsevier电子期刊
”中,
命中:
10
条,耗时:0.0200152 秒
在所有数据库中总计命中:
204
条
1.
Temporal and frequency characteristic analysis of margin-related failures caused by an intermittent nano-scale fracture of the
solder
ball
in a BGA package device
作者:
Hosung Lee
;
Sanghyeon Baeg
;
bau@hanyang.ac.kr
;
Nelson Hua
;
ShiJie Wen
关键词:
Solder
ball
defect
;
Solder
ball
fracture
;
Intermittent failure
;
Ball
grid array package device
;
AC-coupling
;
Frequency characteristic
刊名:Microelectronics Reliability
出版年:2017
2.
Optimization modeling of the cooling stage of reflow
solder
ing process for
ball
grid array package using the gray-based Taguchi method
作者:
Chun-Sean Lau
a
;
chun_sean@hotmail.com
;
M.Z. Abdullah
a
;
F. Che Ani
b
刊名:Microelectronics Reliability
出版年:2012
3.
A study of SnAgCu
solder
paste transfer efficiency and effects of optimal reflow profile on
solder
deposits
作者:
E.H. Amalu
a
;
E.H.Amalu@greenwich.ac.uk"" rel=""nofollow
;
W.K. Lau
b
;
N.N. Ekere
a
;
R.S. Bhatti
a
;
S. Mallik
a
;
K.C. Otiaba
a
;
G. Takyi
c
关键词:
Stencil printing
;
Pb-free
solder
;
Reflow profile
;
Solder
deposit
;
Transfer efficiency
;
Surface mount packages
刊名:Microelectronic Engineering
出版年:2011
4.
Automated inspection and classification of flip-chip-contacts using scanning acoustic microscopy
作者:
S. Br
;
P. Czurratis
;
P. Hoffrogge
;
M. Petzold
刊名:Microelectronics Reliability
出版年:2010
5.
Kinetics and microstructural aspects of the allotropic transition in tin
作者:
S. Gialanella
;
F. Deflorian
;
F. Girardi
;
I. Lonardelli
;
S. Rossi
关键词:
Metals and alloys
;
Mechanochemical processing
;
Phase transitions
;
Calorimetry
;
X-ray diffraction
刊名:Journal of Alloys and Compounds
出版年:2009
6.
The feature extraction and analysis of flaw detection and classification in BGA gold-plating areas
作者:
Yih-Chih Chiou
;
Chern-Sheng Lin
;
Bor-Cheng Chiou
关键词:
Color image segmentation
;
BGA
;
Neural network
;
Flaw detection/classification
刊名:Expert Systems with Applications
出版年:2008
7.
Quality control problem in printed circuit board manufacturing—An extended rough set theory approach
作者:
Tzu-Liang Bill Tseng
;
M.C. Jothishankar
;
Tong Teresa Wu
关键词:
Data Mining
;
Rough Set Theory
;
PCB Assembly
;
Quality Engineering
;
Manufacturing Fault Detection
刊名:Journal of Manufacturing Systems
出版年:2004
8.
Full
ball
shear metrology as
defect
detection and analysis tool for
solder
joint reliability assessment on direct immersion gold technology
刊名:Microelectronics Reliability
出版年:2004
9.
A new application of acoustic micro imaging: screening MCM-C multilayer
defect
s
作者:
Harsá
;
nyi
;
G.
;
Semmens
;
J.E.
;
Martell
;
S.R.
刊名:Microelectronics Reliability
出版年:2000
10.
The use of impedance spectroscopy, SEM and SAM imaging for early detection of failure in SMT assemblies
作者:
Ousten
;
Y.
;
Mejdi
;
S.
;
Fenech
;
A.
;
Deletage
;
J.Y.
;
Bechou
;
L.
;
Perichaud
;
M.G.
;
Danto
;
Y.
刊名:Microelectronics Reliability
出版年:1998
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