设为首页
收藏本站
网站地图
|
English
|
公务邮箱
About the library
Background
History
Leadership
Organization
Readers' Guide
Opening Hours
Collections
Help Via Email
Publications
Electronic Information Resources
常用资源
电子图书
期刊论文
学位会议
外文资源
特色专题
内部出版物
CNKI学位论文(118)
知网期刊论文(152)
在“
Elsevier电子期刊
”中,
命中:
33
条,耗时:小于0.01 秒
在所有数据库中总计命中:
270
条
1.
Effect of
ultrasonic
vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency
ultrasonic
-assisted reflow
soldering
作者:
Ai Ting Tan
aiting2602@gmail.com" class="auth_mail" title="E-mail the corresponding author
;
Ai Wen Tan
aiwen_2101@hotmail.com" class="auth_mail" title="E-mail the corresponding author
;
Farazila Yusof
;
farazila@um.edu.my" class="auth_mail" title="E-mail the corresponding author
关键词:
Ultrasonic
soldering
;
Vibration time
;
Reflow
;
Lead-free
;
Microstructure
;
Mechanical properties
刊名:
Ultrasonic
s Sonochemistry
出版年:2017
2.
Study on the microstructure and mechanical properties of Cu-Sn intermetallic joints rapidly formed by
ultrasonic
-assisted transient liquid phase
soldering
作者:
J.H. Liu
;
H.Y. Zhao
关键词:
Ultrasonic
-assisted
soldering
;
Intermetallic joints
;
Microstructure
;
Shear strength
;
Nanoindentation
刊名:Journal of Alloys and Compounds
出版年:2017
3.
Rapid formation of Ni
3
Sn
4
joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process
作者:
Z.L. Li
a
;
H.J. Dong
a
;
X.G. Song
a
;
b
;
xgsong@hitwh.edu.cn
;
H.Y. Zhao
a
;
b
;
J.C. Feng
a
;
b
;
J.H. Liu
a
;
H. Tian
a
;
S.J. Wang
a
关键词:
Ultrasonic
soldering
;
TLP bonding
;
Ni3Sn4 joints
;
Grain morphology
;
Orientation relationship
;
EBSD
刊名:
Ultrasonic
s Sonochemistry
出版年:2017
4.
Ultrasonic
semi-solid coating
soldering
6061 aluminum alloys with Sn-Pb-Zn alloys
作者:
Xin-ye Yu
a
;
Wen-qing Xing
a
;
Min Ding
a
;
b
;
c
;
dingmin@tyut.edu.cn" class="auth_mail" title="E-mail the corresponding author
关键词:
Crystallization behavior
;
Ultrasonic
semi-solid coating
soldering
;
6061 aluminum alloy
;
Shear strength
刊名:
Ultrasonic
s Sonochemistry
出版年:2016
5.
Rapid formation of intermetallic joints through
ultrasonic
-assisted die bonding with Sn-0.7Cu solder for high temperature packaging application
作者:
Hongjun Ji
;
jhj7005@hit.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Yunfei Qiao
;
Mingyu Li
;
myli@hit.edu.cn" class="auth_mail" title="E-mail the corresponding author
关键词:
Ultrasonic
-assisted
soldering
;
Die bonding
;
Microstructure
;
Intermetallic joint
;
Thermal conductivity
刊名:Scripta Materialia
出版年:2016
6.
Flux-less direct
soldering
of aluminum by
ultrasonic
surface activation
作者:
Somayeh Gheybi Hashemabad
a
;
s.gheybi@gmail.com" class="auth_mail" title="E-mail the corresponding author
;
Zhiyong Gu
b
;
zhiyong_Gu@uml.edu" class="auth_mail" title="E-mail the corresponding author
;
Teiichi Ando
a
;
tando@coe.neu.edu" class="auth_mail" title="E-mail the corresponding author
关键词:
UPC
;
ultrasonic
powder consolidation
刊名:Journal of Materials Processing Technology
出版年:2016
7.
Influence of high-power-low-frequency
ultrasonic
vibration time on the microstructure and mechanical properties of lead-free solder joints
作者:
Ai Ting Tan
a
;
b
;
Ai Wen Tan
a
;
b
;
Farazila Yusof
a
;
b
;
farazila@um.edu.my" class="auth_mail" title="E-mail the corresponding author
;
farazila@gmail.com" class="auth_mail" title="E-mail the corresponding author
关键词:
Ultrasonic
soldering
;
Vibration time
;
Lead-free solder joint
;
Microstructure
;
Shear strength
;
Hardness
刊名:Journal of Materials Processing Technology
出版年:2016
8.
Ni
3
Sn
4
-composed die bonded interface rapidly formed by
ultrasonic
-assisted
soldering
of Sn/Ni solder paste for high-temperature power device packaging
作者:
Hongjun Ji
;
jhj7005@hit.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Minggang Li
;
Shu Ma
;
Mingyu Li
myli@hit.edu.cn" class="auth_mail" title="E-mail the corresponding author
关键词:
Ultrasonic
-assisted bonding
;
Die bonding
;
Tin-nickel compounds
;
Power electronics
;
Interconnections
;
Aging
刊名:Materials & Design
出版年:2016
9.
Si particulate-reinforced ZnAl based composites joints of hypereutectic Al50Si alloys by
ultrasonic
-assisted
soldering
作者:
Qian Wang
a
;
Lin Zhu
a
;
Xiaoguang Chen
b
;
Jiuchun Yan
b
;
Ruishan Xie
c
;
Peihao Li
d
;
Zhihua Wang
a
;
Zhiqi Wang
a
;
Yuntao Li
a
;
Xiaoyu Zhou
a
;
hit_doctor_job@126.com" class="auth_mail" title="E-mail the corresponding author
关键词:
Ultrasonic
;
Joining
;
Hypereutectic AlSi alloys
;
Solidification
;
Microstructure
;
Mechanical properties
刊名:Materials & Design
出版年:2016
10.
Quality Assurance of Brazed Copper Plates through Advanced
Ultrasonic
NDE
作者:
Tiziana Segreto
a
;
b
;
tsegreto@unina.it" class="auth_mail" title="E-mail the corresponding author
;
Alessandra Caggiano
b
;
c
;
Roberto Teti
a
;
b
关键词:
Pure copper brazing
;
Quality assurance
;
Ultrasonic
non-destructive evaluation
刊名:Procedia CIRP
出版年:2016
1
2
3
4
按检索点细分(33)
题名(15)
关键词(17)
文摘(29)
按出版年细分(33)
2027年及以后(2)
2017年(3)
2016年(9)
2013年(2)
2012年(3)
2011年(6)
2010年(1)
2009年(1)
2008年(1)
2005年(1)
2002年(1)
2001年(2)
2000年(1)
NGLC 2004-2010.National Geological Library of China All Rights Reserved.
Add:29 Xueyuan Rd,Haidian District,Beijing,PRC. Mail Add: 8324 mailbox 100083
For exchange or info please contact us via
email
.