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SpringerLink电子期刊(2)
在“
SpringerLink电子期刊
”中,
命中:
2
条,耗时:小于0.01 秒
在所有数据库中总计命中:
2
条
1.
Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design
作者:
Chuantong Chen
;
Shijo
Nagao
;
Hao Zhang
;
Jinting Jiu
8230
关键词:
Sintered Ag paste
;
mechanical properties
;
plastic deformation mechanism
;
SiC wide
;
bandgap power devices
;
3D finite
;
element modeling
;
size effect
刊名:Journal of Electronic Materials
出版年:2017
2.
Thermal Fatigue Behavior of Silicon-Carbide-Doped Silver Microflake Sinter Joints for Die Attachment in Silicon/Silicon Carbide Power Devices
作者:
Hao Zhang
;
Chuantong Chen
;
Shijo
Nagao
8230
关键词:
Silver flake
;
sinter joining
;
die attachment
;
thermal cycling
;
wide
;
bandgap semiconductor
;
silicon carbide
刊名:Journal of Electronic Materials
出版年:2017
1
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按出版年细分(2)
2017年(2)
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