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内部出版物
SpringerLink电子期刊(3)
在“
SpringerLink电子期刊
”中,
命中:
3
条,耗时:小于0.01 秒
在所有数据库中总计命中:
3
条
1.
Electrochemical micro machining characteristics of Fe
64
Ni
36
invar film using micro WC rod electrode
作者:
Woong
-
Kirl
Choi
;
Seong-Hyun Kim
;
Eun-Sang Lee
刊名:Microsystem Technologies
出版年:2017
2.
Effect of pad’s surface deformation and oscillation on monocrystalline silicon wafer surface quality
作者:
Woong
-
Kirl
Choi
(1)
Seong-Hyun Kim (1)
Seung-Geon Choi (1)
Eun-Sang Lee (2)
Chul-Hee Lee (2)
关键词:
Monocrystalline wafer
;
Surface quality
;
Optimum condition
;
Pad deformation
;
Oscillation
刊名:International Journal of Precision Engineering and Manufacturing
出版年:2014
3.
Study on the effect of various machining speeds on the wafer polishing process
作者:
Eun Sang Lee (1)
Sang Gyun Lee (1)
Woong
Kirl
Choi
(1)
Seung Geon Choi (1)
关键词:
Wafer polishing
;
Machining speed
;
Machining temperature
;
Temperature variation
;
Surface roughness
刊名:Journal of Mechanical Science and Technology
出版年:2013
1
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