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GSW全文库(2)
ACS电子期刊(4)
SpringerLink电子期刊(53)
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在“
SpringerLink电子期刊
”中,
命中:
53
条,耗时:小于0.01 秒
在所有数据库中总计命中:
167
条
1.
Corrosion behavior of three Ag–50Cu
alloy
s prepared by different processes in NaCl solutions
作者:
Zhong-Qiu Jia
;
Qiu-Ying Liang
;
Qiu-Yue Tian
;
Zhong-Qiu Cao
;
Yan Wang
关键词:
Electrochemical corrosion
;
Ag–Cu
alloy
;
Preparation processes
;
Nanocrystalline
刊名:Rare Metals
出版年:2017
2.
Joining of SiO
2f
/SiO
2
composite to Al
2
O
3
ceramic using
AgCu
-Ti brazing filler metal
作者:
Shi-Biao Wu
;
Hua-Ping Xiong
;
Bo Chen
;
Yao-Yong Cheng
关键词:
(IIW Thesaurus)Brazing
;
Dissimilar materials
;
Ceramics
;
Composite materials
;
Microstructure
;
Shear strength
;
Process parameters
刊名:Welding in the World
出版年:2017
3.
Wetting and interactions of Ag–Cu–Ti and Ag–Cu–Ni
alloy
s with ceramic and steel substrates for use as sealing materials in a DCFC stack
作者:
G. Triantafyllou
;
J. T. S. Irvine
刊名:Journal of Materials Science
出版年:2016
4.
Effect of oxygen on the wettability of 304L stainless steel by liquid Ag–Cu eutectic
alloy
作者:
Youngjo Kang
;
Jihye Han
;
Hyelim Kim
;
Joonho Lee
刊名:Journal of Materials Science
出版年:2016
5.
Thermal properties of ZnO and bimetallic Ag–Cu
alloy
reinforced poly(lactic acid) nanocomposite films
作者:
Jasim Ahmed
;
Yasir Ali Arfat…
刊名:Journal of Thermal Analysis and Calorimetry
出版年:2016
6.
Microstructure and melting properties of Ag–Cu–In intermediate-temperature brazing
alloy
s
作者:
Xue Ma
;
Liang-Feng Li
;
Zu-Hua Zhang
;
Hao Wang
;
En-Ze Wang
;
Tai Qiu
关键词:
Ag–Cu–In
alloy
;
Arc melting
;
Melting property
;
Microstructure
;
Hardness
刊名:Rare Metals
出版年:2015
7.
Morphology, Structural and Electrical Properties of Ag–Cu
Alloy
Nanoparticles Embedded in PVA Matrix and Its Performance as E. coli Monitoring Sensor
作者:
Huda Abdullah
;
Norshafadzila Mohammad Naim…
关键词:
Ag–Cu
alloy
;
PVA
;
Morphology
;
Structural properties
;
Electrical properties
;
E. coli
;
Sensor
刊名:Arabian Journal for Science and Engineering
出版年:2015
8.
LED Die-Bonded on the Ag/Cu Substrate by a Sn-BiZn-Sn Bonding System
作者:
Y. K. Tang
;
Y. C. Hsu
;
E. J. Lin
;
Y. J. Hu
;
C. Y. Liu
关键词:
Die
;
attachment
;
lead
;
free solder
;
die strength
;
partial pressure
;
Sn
;
Bi
;
Zn solder
刊名:Journal of Electronic Materials
出版年:2016
9.
Thermal stability of Ag–Au, Cu–Au, and Ag–Cu bimetallic nanoparticles supported on highly oriented pyrolytic graphite
作者:
A. V. Bukhtiyarov
;
I. P. Prosvirin
;
I. A. Chetyrin
;
A. A. Saraev…
关键词:
bimetallic catalysts
;
highly oriented pyrolytic graphite
X ;
ray photoelectron spectroscopy
;
thermal stability
刊名:Kinetics and Catalysis
出版年:2016
10.
Electrochemical fabrication of Ag–Cu nano
alloy
and its characterization: an investigation
作者:
A. Abdul Salam
;
R. Singaravelan
;
P. Vasanthi…
关键词:
Bimetallic nano
alloy
;
Optical band gap
;
Electrodeposition
;
Diffuse reflectance
;
Williamson–Hall
刊名:Journal of Nanostructure in Chemistry
出版年:2015
1
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3
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