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在“SpringerLink电子期刊”中，命中：16条，耗时：小于0.01 秒

1. Solidification microstructures in Ag3Sn–Cu3Sn pseudo-binary alloys

作者： Haibo Yu ; Yu Sun ; S. Pamir Alpay ; Mark Aindow

刊名：Journal of Materials Science

出版年：2016

2. Effects of Cooling Rate on the Microstructure and Morphology of Sn-3.0Ag-0.5Cu Solder

作者： Hwa-Teng Lee ; Kuo-Chen Huang

关键词：Sn ; Ag ; Cu ; cooling rate ; Ag3Sn ; Cu6Sn5

刊名：Journal of Electronic Materials

出版年：2016

3. Asymmetrical Precipitation of Ag3Sn Intermetallic Compounds Induced by Thermomigration of Ag in Pb-Free Microbumps During Solid-State Aging

作者： Yu-Ping Su ; Chun-Sen Wu ; Fan-Yi Ouyang

刊名：Journal of Electronic Materials

出版年：2016

4. Influence of the aggregated Ag3Sn on the improvement of electromigration phenomenon in the doped Sn58Bi solder joints

作者： Huayu Sun ; Y. C. Chan…

刊名：Journal of Materials Science: Materials in Electronics

出版年：2015

5. Quantitative analyses of Ag3Sn intermetallic compound formation in SnAgCu solder alloys

作者： Tamás Garami ; Olivér Krammer

刊名：Journal of Materials Science: Materials in Electronics

出版年：2015

6. Improved drop reliability of Sn–Ag–Cu solder joints by Zn addition to a Cu wetting layer

作者： Jae-Yong Park ; Young Min Kim ; Young-Ho Kim

刊名：Journal of Materials Science: Materials in Electronics

出版年：2015

7. Microstructure, elastic modulus and shear strength of alumina (Al2O3) nanoparticles-doped tin–silver–copper (Sn–Ag–Cu) solders on copper (Cu) and gold/nickel (Au/Ni)-plated Cu substrates

作者： Asit Kumar Gain ; Liangchi Zhang ; Y. C. Chan

刊名：Journal of Materials Science: Materials in Electronics

出版年：2015

8. Effect of microstructure and Ag3Sn intermetallic compounds on corrosion behavior of Sn-.0Ag-.5Cu lead-free solder

作者：Mingna Wang (1)
Jianqiu Wang (2)
Wei Ke (2)

刊名：Journal of Materials Science: Materials in Electronics

出版年：2014

9. The Role of Silver in Mitigation of Whisker Formation on Thin Tin Films

作者： J. Stein ; S. Rehm ; U. Welzel ; W. Huegel…

关键词：Sn ; Ag ; tin whisker ; whisker mitigation ; x ; ray diffraction

刊名：Journal of Electronic Materials

出版年：2014

10. A Study on the Physical Properties and Interfacial Reactions with Cu Substrate of Rapidly Solidified Sn-3.5Ag Lead-Free Solder

作者：Hai-Tao Ma (1)
Jie Wang (1)
Lin Qu (1)
Ning Zhao (1)
A. Kunwar (1)

关键词：Lead ; free solder ; rapidly solidified solder ; wettability ; IMCs ; Ag3Sn

刊名：Journal of Electronic Materials

出版年：2013

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