设为首页
收藏本站
网站地图
|
English
|
公务邮箱
About the library
Background
History
Leadership
Organization
Readers' Guide
Opening Hours
Collections
Help Via Email
Publications
Electronic Information Resources
常用资源
电子图书
期刊论文
学位会议
外文资源
特色专题
内部出版物
CNKI学位论文(2)
知网期刊论文(3)
在“
SpringerLink电子期刊
”中,
命中:
6
条,耗时:小于0.01 秒
在所有数据库中总计命中:
5
条
1.
Effects of Solidification Thermal Parameters on Microstructure and Mechanical Properties of Sn-Bi Solder Alloys
作者:
Bismarck
Luiz
Silva
;
Vítor Covre Evangelista da
Silva
…
关键词:
Sn
;
Bi alloys
;
solidification
;
microstructure
;
Bi precipitates
;
tensile strength
;
fracture surface
刊名:Journal of Electronic Materials
出版年:2017
2.
Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys
作者:
Bismarck
Luiz
Silva
;
Felipe Bertelli…
刊名:Journal of Materials Science: Materials in Electronics
出版年:2016
3.
Experimental and numerical analyses of laser remelted Sn-.7?wt%Cu solder surfaces
作者:
Bismarck
Luiz
Silva
;
José Eduardo Spinelli…
刊名:Journal of Materials Science: Materials in Electronics
出版年:2015
4.
Assessment of Tertiary Dendritic Growth and Its Effects on Mechanical Properties of Directionally Solidified Sn-0.7Cu-xAg Solder Alloys
作者:
José Eduardo Spinelli (1)
Bismarck
Luiz
Silva
(1)
Amauri Garcia (2)
关键词:
Solidification
;
microstructure
;
IMC
;
tensile properties
;
solders
刊名:Journal of Electronic Materials
出版年:2014
5.
Thermal Parameters, Microstructure, and Mechanical Properties of Directionally Solidified Sn-0.7聽wt.%Cu Solder Alloys Containing 0聽ppm to 1000聽ppm Ni
作者:
Bismarck
Luiz
Silva
(1)
No茅 Cheung (2)
Amauri Garcia (3)
Jos茅 Eduardo Spinelli (1)
关键词:
Solidification
;
microstructure
;
thermal parameters
;
mechanical properties
;
solder alloys
刊名:Journal of Electronic Materials
出版年:2013
6.
Thermal Parameters, Microstructure, and Mechanical Properties of Directionally Solidified Sn-0.7?wt.%Cu Solder Alloys Containing 0?ppm to 1000?ppm Ni
作者:
Bismarck
Luiz
Silva
(1)
Noé Cheung (2)
Amauri Garcia (3)
José Eduardo Spinelli (1)
关键词:
Solidification
;
microstructure
;
thermal parameters
;
mechanical properties
;
solder alloys
刊名:Journal of Electronic Materials
出版年:2013
1
按检索点细分(6)
作者(6)
按出版年细分(6)
2017年(1)
2016年(1)
2015年(1)
2014年(1)
2013年(2)
NGLC 2004-2010.National Geological Library of China All Rights Reserved.
Add:29 Xueyuan Rd,Haidian District,Beijing,PRC. Mail Add: 8324 mailbox 100083
For exchange or info please contact us via
email
.