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Springer电子图书(1)
CNKI学位论文(115)
知网期刊论文(80)
在“
SpringerLink电子期刊
”中,
命中:
20
条,耗时:小于0.01 秒
在所有数据库中总计命中:
196
条
1.
Surface integrity and removal mechanism of chemical mechanical grinding of silicon
wafer
s using a newly developed wheel
作者:
Zhigang Dong
;
Shang Gao
;
Han Huang…
关键词:
Silicon
wafer
;
Grinding
;
Chemical mechanical
;
Surface
;
Subsurface damage
刊名:The International Journal of Advanced Manufacturing Technology
出版年:2016
2.
Back-
thinning
process research and characteristics measurement of thin sensor
作者:
H. B. Jeon
;
K. H. Kang
;
H. Park
;
Kun-Sik Park
关键词:
Thinning
process
;
Photodiode
;
Laser annealing
;
Electrical characteristics
;
Signal
;
to
;
noise ratio
刊名:Journal of the Korean Physical Society
出版年:2015
3.
Determination of Initial Crack Strength of Silicon Die Using Acoustic Emission Technique
作者:
Pei-Chi Chen
;
Yen-Fu Su
;
Shin-Yueh Yang
;
Steven Y. Liang…
关键词:
Initial crack strength
;
ball breaker test
;
acoustic emission system
;
finite
;
element analysis
;
surface roughness
刊名:Journal of Electronic Materials
出版年:2015
4.
Quartz resonator assembling with TSV interposer using polymer sealing or metal bonding
作者:
Jian-Yu Shih (1)
Yen-Chi Chen (2)
Chih-Hung Chiu (2)
Chung-Lun Lo (2)
Chi-Chung Chang (2)
Kuan-Neng Chen (1)
1. Department of Electronics Engineering
;
National Chiao Tung University
;
Hsinchu
;
300
;
Taiwan
2. TXC Corporation
;
Taoyuan
;
324
;
Taiwan
关键词:
Three
;
dimensional (3D) integration
;
Through
;
silicon via (TSV)
;
Wafer
thinning
;
Sealing bonding
刊名:Nanoscale Research Letters
出版年:2014
5.
Origin of the TTV of thin films obtained by temporary bonding ZoneBond? technology
作者:
P. Montméat
;
T. Enot
;
M. Pellat
;
F. Fournel
;
L. Bally
;
L. Baud…
刊名:Microsystem Technologies
出版年:2015
6.
Indirect
Wafer
Bonding and Epitaxial Transfer of GaSb-Based Materials
作者:
M. Grzesik (1)
S. R. Vangala (2)
W. D. Goodhue (1) (2)
关键词:
Wafer
bonding
;
GaSb
;
BCB
;
InAsSb
;
selective etch
;
mechanical properties
刊名:Journal of Electronic Materials
出版年:2013
7.
Indirect
Wafer
Bonding and Epitaxial Transfer of GaSb-Based Materials
作者:
M. Grzesik (1)
S. R. Vangala (2)
W. D. Goodhue (1) (2)
关键词:
Wafer
bonding
;
GaSb
;
BCB
;
InAsSb
;
selective etch
;
mechanical properties
刊名:Journal of Electronic Materials
出版年:2013
8.
A state-of-the-art review of ductile cutting of silicon
wafer
s for semiconductor and microelectronics industries
作者:
Muhammad Arif (1)
Mustafizur Rahman (1)
Wong Yoke San (1)
关键词:
Ductile
;
mode machining
;
Ultraprecision machining
;
Silicon
wafer
s
;
Silicon machining
刊名:The International Journal of Advanced Manufacturing Technology
出版年:2012
9.
Design, fabrication, testing and packaging of a silicon micromachined radio frequency microelectromechanical series (RF MEMS) switch
作者:
M S GIRIDHAR (1)
ASHWINI JAMBHALIKAR (1)
JIJU JOHN (1)
R ISLAM (1)
ANANDA BEHERA (1)
C L NAGENDRA (1)
GEORGE THACHIL (1)
M P SRIKANTH (1)
SHAILESH SOMANI (1)
B H M DARUKESHA (2)
SRINIVASARAO BOLLU (2)
关键词:
RF MEMS switch
;
bulk silicon micromachining
;
wafer
level RF measurements
;
RF device packaging
刊名:Sadhana
出版年:2013
10.
Design, fabrication, testing and packaging of a silicon micromachined radio frequency microelectromechanical series (RF MEMS) switch
作者:
M S GIRIDHAR (1)
ASHWINI JAMBHALIKAR (1)
JIJU JOHN (1)
R ISLAM (1)
ANANDA BEHERA (1)
C L NAGENDRA (1)
GEORGE THACHIL (1)
M P SRIKANTH (1)
SHAILESH SOMANI (1)
B H M DARUKESHA (2)
SRINIVASARAO BOLLU (2)
关键词:
RF MEMS switch
;
bulk silicon micromachining
;
wafer
level RF measurements
;
RF device packaging
刊名:Sadhana
出版年:2013
1
2
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