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在“
SpringerLink电子期刊
”中,
命中:
466
条,耗时:小于0.01 秒
在所有数据库中总计命中:
18,193
条
1.
The Failure Models of Lead Free Sn-3.
0
Ag-
0
.
5Cu
Solder Joint Reliability Under Low-G and High-G Drop Impact
作者:
Jian Gu
;
YongPing Lei
;
Jian Lin
;
HanGuang Fu̷
0
关键词:
Lead free
;
drop impact
;
low
G ;
failure performance
刊名:Journal of Electronic Materials
出版年:2
0
17
2.
The Melting Characteristics and Interfacial Reactions of Sn-ball/Sn-3.
0
Ag-
0
.
5Cu
-paste/Cu Joints During Reflow Soldering
作者:
J. Q. Huang
;
M. B. Zhou
;
X. P. Zhang
关键词:
Lead
;
free solder joint
;
ball grid array
;
interfacial reaction
;
premelting behavior
;
differential scanning calorimetry
刊名:Journal of Electronic Materials
出版年:2
0
17
3.
In situ X-ray observation and simulation of ratcheting-fatigue interactions in solder joints
作者:
Liting Shi
;
Yunhui Mei
;
Gang Chen
;
Xu Chen
关键词:
in situ
;
ratcheting
;
fatigue
X ;
ray
;
damage
;
coupled
;
Sn
;
3Ag
;
0
.
5Cu
(SAC3
0
5)
刊名:Electronic Materials Letters
出版年:2
0
17
4.
Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn–
0
.
5Cu
solders for microelectronic applications
作者:
A. A. Ibrahiem
;
E. H. El-Khawas̷
0
刊名:Journal of Materials Science: Materials in Electronics
出版年:2
0
17
5.
Thermal analysis study on the grain refinement of Al–15Zn–2.5Mg–2.
5Cu
alloy
作者:
S. Mostafapoor
;
M. Malekan
;
M. Emamy
关键词:
Al–Zn–Mg–Cu alloy
;
Grain refinement
;
Solidification
;
Thermal analysis
刊名:Journal of Thermal Analysis and Calorimetry
出版年:2
0
17
6.
Synthesis, Characterization and Thermal Property of Phosphate and Sulfate Mixtures
作者:
Trilochan Swain
;
Gouri Sankhar Brahma
关键词:
DSC
;
Specific heat capacity
;
Nanophosphate
;
Optical property
;
Sensible heat
刊名:Journal of Inorganic and Organometallic Polymers and Materials
出版年:2
0
17
7.
Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.
0
Ag
0
.
5Cu
Solder Paste Reinforced with Ceramic Nanoparticles
作者:
A. Yakymovych
;
Yu. Plevachuk
;
P. Švec Sr.
;
P. Švec̷
0
关键词:
Sn3.
0
Ag
0
.
5Cu
;
ceramic nanoparticles
;
microstructure
;
shear strength
刊名:Journal of Electronic Materials
出版年:2
0
16
8.
Microhardness and shear performance of Fe/Bi-bearing SAC1
0
5 solder alloys under high temperature aging
作者:
Bakhtiar Ali
;
Mohd Faizul Mohd Sabri̷
0
刊名:Journal of Materials Science: Materials in Electronics
出版年:2
0
17
9.
Al and Si Alloying Effect on Solder Joint Reliability in Sn-
0
.
5Cu
for Automotive Electronics
作者:
Won Sik Hong
;
Chulmin Oh
;
Mi-Song Kim
;
Young Woo Lee̷
0
关键词:
Automotive electronics
;
Pb
;
free
;
solder joint
;
degradation
;
end
;
of
;
life vehicles (ELV)
刊名:Journal of Electronic Materials
出版年:2
0
16
10.
Assessment of Joint Reliability of Sn᾿.5Ag᾿.
5Cu
Solder/Cu as a Function of Reflow Time
作者:
Mrunali Sona
;
K. Narayan Prabhu
关键词:
Lead
;
free solders
;
IMC
;
Shear strength
刊名:Transactions of the Indian Institute of Metals
出版年:2
0
16
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