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在“
SpringerLink电子期刊
”中,
命中:
121
条,耗时:小于0.01 秒
在所有数据库中总计命中:
2,586
条
1.
A Study on the Nanofiber-Sheet Anisotropic Conductive Films (NS-ACFs) for Ultra-
Fine
-
Pitch
Interconnection Applications
作者:
Sang-Hoon Lee
;
Kyung-Wook Paik
关键词:
Nanofiber
;
sheet (NS)
;
nanofiber
;
electrospinning
;
anisotropic conductive films (ACFs)
;
ultra
;
fine
;
pitch
interconnection
;
plasma etching
刊名:Journal of Electronic Materials
出版年:2017
2.
MEMS-based Ni–B probe with enhanced mechanical properties for
fine
pitch
testing
作者:
Kyongtae Kim
;
Hong-Beom Kwon
;
Hye-Rin Ahn
;
Yong-Jun Kim
关键词:
Ni–B micro
;
probe
;
Ni–Co micro
;
probe
;
Contact force
;
Deformation
刊名:Micro and Nano Systems Letters
出版年:2017
3.
Reliability of an ultra-
fine
-
pitch
COF flip-chip package using non-conductive paste
作者:
Hae-Yeon Kim
;
Kyung-Eun Min
;
Jun-Sik Lee
;
So-Jeong Lee…
关键词:
non
;
conductive paste
;
flip
;
chip package
;
chip
;
on
;
film
;
ultra
;
fine
pitch
;
reliability
刊名:Electronic Materials Letters
出版年:2016
4.
Nanofiber Anisotropic Conductive Films (ACF) for Ultra-
Fine
-
Pitch
Chip-on-Glass (COG) Interconnections
作者:
Sang-Hoon Lee
;
Tae-Wan Kim
;
Kyung-Lim Suk…
关键词:
Anisotropic conductive films (ACF)
;
ultra
;
fine
;
pitch
;
chip
;
on
;
glass (COG) interconnection
;
nanofiber
;
electrospinning
刊名:Journal of Electronic Materials
出版年:2015
5.
Electrochemical Migration of
Fine
-
Pitch
Nanopaste Ag Interconnects
作者:
Chia-Hung Tsou
;
Kai-Ning Liu
;
Heng-Tien Lin…
关键词:
Electrochemical migration
;
Ag dendrite
;
silver nanopaste
;
THB test
;
WD test
刊名:Journal of Electronic Materials
出版年:2016
6.
Low-frequency
pitch
perception in children with cochlear implants in comparison to normal hearing peers
作者:
Hilal Dincer D’Alessandro
;
Roberto Filipo…
关键词:
Pitch
perception
;
Cochlear implants
;
Children
;
Temporal
Fine
Structure
刊名:European Archives of Oto-Rhino-Laryngology
出版年:2015
7.
Characterization and Modeling of
Fine
-
Pitch
Copper Ball Bonding on a Cu/Low-k Chip
作者:
F. X. Che (1)
L. C. Wai (1)
Xiaowu Zhang (1)
T. C. Chai (1)
1. Institute of Microelectronics
;
A*STAR (Agency for Science
;
Technology and Research)
;
11 Science Park Road
;
Singapore Science Park II
;
Singapore
;
117685
;
Singapore
关键词:
Ball bond
;
Cu/low
;
k
;
Cu wire
;
fine
;
pitch
Cu wire bonding
;
finite
;
element modeling
;
stress sensor
刊名:Journal of Electronic Materials
出版年:2015
8.
Research on the design of the ultra-high-precision positioning control error compensation
作者:
Dae-Kwang Park
;
Gyung-Il Lee
;
Jia-Chen Gao…
关键词:
Ultra
;
high
;
precision positioning
;
Error compensation tool servo
;
Pitch
ing error
;
Rolling error
;
Yawing error
刊名:International Journal of Precision Engineering and Manufacturing
出版年:2016
9.
Whisker Growth Behavior of Sn58Bi Solder Coatings Under Isothermal Aging
作者:
Limin Ma
;
Yong Zuo
;
Sihan Liu
;
Fu Guo
关键词:
Sn58Bi coating
;
bi
;
rich whisker
;
isothermal aging
;
Cu6Sn5
刊名:Journal of Electronic Materials
出版年:2016
10.
Improving the Flexibility of Dynamic Prosody Modification Using Instants of Significant Excitation
作者:
D. Govind
;
Tinu T. Joy
刊名:Circuits, Systems, and Signal Processing
出版年:2016
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