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内部出版物
Wiley电子期刊(3)
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Elsevier电子期刊(195)
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在“
Elsevier电子期刊
”中,
命中:
195
条,耗时:小于0.01 秒
在所有数据库中总计命中:
244
条
1.
Clinical effects of pre-transplant serum 25-hydroxyvitamin D level on post-transplant immunologic and non-immunologic outcomes in kidney transplant recipients
作者:
Tae Hyun Ban
a
;
b
;
Jeong Ho Kim
a
;
b
;
Han
Beol
Jang
a
;
Yoon Seo Lee
a
;
Bum Soon Choi
a
;
b
;
Cheol Whee Park
a
;
b
;
Chul Woo Yang
a
;
b
;
Yong-Soo Kim
a
;
b
;
Byung Ha Chung
a
;
b
;
chungbh@catholic.ac.kr
关键词:
25(OH)D
;
25-hydroxyvitamin D
;
KTRs
;
kidney transplant recipients
;
BPAR
;
biopsy-proven acute rejection
;
BMD
;
bone mineral density
刊名:Transplant Immunology
出版年:2017
2.
Doping of graphene for the application in nano-interconnect
作者:
Xiangyu Wu
a
;
b
;
xiangyu.wu@imec.be
;
Inge Asselberghs
b
;
Maria Politou
a
;
b
;
Antonino Contino
a
;
b
;
Iuliana Radu
b
;
Cedric Huyghebaert
b
;
Zsolt Tokei
b
;
Bart Soree
a
;
b
;
Stefan De Gendt
a
;
b
;
Steven De Feyter
a
;
Marc Heyns
a
;
b
关键词:
Graphene
;
Nano-interconnects
;
Doping
;
Mobility
;
Sheet resistance
刊名:Microelectronic Engineering
出版年:2017
3.
Dielectrics stability for intermediate
BEOL
in 3D sequential integration
刊名:Microelectronic Engineering
出版年:2017
4.
Mixed-mode cohesive zone parameters for sub-micron scale stacked layers to predict microelectronic device reliability
作者:
Sathyanarayanan Raghavan
a
;
sathya@gatech.edu" class="auth_mail" title="E-mail the corresponding author
;
Ilko Schmadlak
b
;
George Leal
c
;
Suresh K. Sitaraman
a
关键词:
Cohesive zone modeling
;
Microelectronic package reliability
;
BEOL
stack fracture
;
ULK cracking
刊名:Engineering Fracture Mechanics
出版年:2016
5.
Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line
作者:
Luka Ključar
a
;
b
;
luka.kljucar@imec.be" class="auth_mail" title="E-mail the corresponding author
;
Mario Gonzá
;
lez
a
;
Ingrid De Wolf
a
;
b
;
Kristof Croes
a
;
Jü
;
rgen Bö
;
mmels
a
;
Zsolt Tőkei
a
关键词:
Design evaluation
;
BEOL
via density
;
Low-k Young's modulus
;
Design/attribute/metric space
;
Shannon entropy
;
Saaty method
;
Membership grade
;
Distance norms
;
Response surface
刊名:Microelectronics Reliability
出版年:2016
6.
Advanced thermal simulation of SiGe:C HBTs including back-end-of-line
作者:
Vincenzo d'Alessandro
a
;
vindales@unina.it
;
Alessandro Magnani
a
;
Lorenzo Codecasa
b
;
Niccolò
;
Rinaldi
a
;
Klaus Aufinger
c
关键词:
Back-end-of-line (
BEOL
)
;
Finite element method (FEM)
;
Heterojunction bipolar transistor (HBT)
;
Self-heating (SH)
;
Silicon germanium (SiGe)
;
Thermal resistance
刊名:Microelectronics Reliability
出版年:2016
7.
Stress-induced trench narrowing in Cu interconnect of sub-20 nm node: FEM simulation
作者:
Dong-Hyun Kim
a
;
dhkim0235@gmail.com" class="auth_mail" title="E-mail the corresponding author
;
dh0131.kim@samsung.com" class="auth_mail" title="E-mail the corresponding author
;
Sung-Wook Mhin
b
;
Myung-Hwan Byun
c
;
myunghbyun@kmu.ac.kr" class="auth_mail" title="E-mail the corresponding author
关键词:
BEOL
;
Trench
;
Failure
;
Mechanical stress
;
FEM
刊名:Materials Science in Semiconductor Processing
出版年:2016
8.
Effects of
BEOL
on self-heating and thermal coupling in SiGe multi-finger HBTs under real operating condition
作者:
A.D.D. Dwivedi
a
;
arun-dev-dhar.dwivedi@ims-bordeaux.fr" class="auth_mail" title="E-mail the corresponding author
;
adddwivedi@gmail.com" class="auth_mail" title="E-mail the corresponding author
;
Anjan Chakravorty
b
;
anjan@ee.iitm.ac.in" class="auth_mail" title="E-mail the corresponding author
;
Rosario D&rsquo
;
Esposito
a
;
rosario.desposito@ims-bordeaux.fr" class="auth_mail" title="E-mail the corresponding author
;
Amit Kumar Sahoo
a
;
amit7phy@gmail.com" class="auth_mail" title="E-mail the corresponding author
;
Sebastien Fregonese
a
;
sebastien.fregonese@ims-bordeaux.fr" class="auth_mail" title="E-mail the corresponding author
;
Thomas Zimmer
a
;
thomas.zimmer@ims-bordeaux.fr" class="auth_mail" title="E-mail the corresponding author
关键词:
SiGe
;
Multi-finger HBT
;
TCAD
;
Self-heating
;
Thermal coupling
;
Compact model
刊名:Solid State Electronics
出版年:2016
9.
Impact of HF-based cleaning solutions on via resistance for sub-10 nm
BEOL
structures
作者:
B. Peethala
a
;
peethala@us.ibm.com" class="auth_mail" title="E-mail the corresponding author
;
F.W. Mont
b
;
S. Molis
c
;
R. Knarr
d
;
B. L'lherron
e
;
C. Labelle
b
;
D. Canaperi
a
;
S. Siddiqui
b
;
Shariq.Siddiqui@globalfoundries.com" class="auth_mail" title="E-mail the corresponding author
关键词:
Multiple patterning
;
Via interface
;
Cu surface cleaning
;
Ultra-dilute HF solutions
刊名:Microelectronic Engineering
出版年:2016
10.
Band diagram for low-k/Cu interconnects: The starting point for understanding back-end-of-line (
BEOL
) electrical reliability
作者:
Michael J. Mutch
a
;
Thomas Pomorski
a
;
Brad C. Bittel
a
;
b
;
Corey J. Cochrane
c
;
Patrick M. Lenahan
a
;
c
;
pmlesm@engr.psu.edu" class="auth_mail" title="E-mail the corresponding author
;
Xin Liu
d
;
Robert J. Nemanich
d
;
Justin Brockman
e
;
Marc French
e
;
Markus Kuhn
e
;
Benjamin French
f
;
Sean W. King
e
;
sean.king@intel.com" class="auth_mail" title="E-mail the corresponding author
关键词:
Low-k
;
Interconnect
;
Band diagram
;
XPS
;
EPR
;
Magnetic resonance
刊名:Microelectronics Reliability
出版年:2016
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