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CNKI学位论文(83)
知网期刊论文(49)
在“
Elsevier电子期刊
”中,
命中:
42
条,耗时:小于0.01 秒
在所有数据库中总计命中:
132
条
1.
Hybrid erosive jet micro-milling of sintered ceramic wafers with and without copper-
filled
through-holes
作者:
K. Kowsari
a
;
M.R. Sookhaklari
b
;
H. Nouraei
a
;
M. Papini
b
;
a
;
mpapini@ryerson.ca" class="auth_mail" title="E-mail the corresponding author
;
J.K. Spelt
a
;
b
;
spelt@mie.utoronto.ca" class="auth_mail" title="E-mail the corresponding author
关键词:
Micro-machining
;
Abrasive particle
;
Slurry jet
;
Air jet
;
Pocket
;
Sintered ceramic
;
Planar area
;
Selective etching
;
Plated through-holes
;
Filled
vias
刊名:Journal of Materials Processing Technology
出版年:2016
2.
Protrusion of electroplated copper
filled
in through silicon
vias
during annealing process
作者:
Si Chen
a
;
Fei Qin
a
;
qfei@bjut.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Tong An
a
;
antong@bjut.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Pei Chen
a
;
Bin Xie
b
;
Xunqing Shi
b
关键词:
Through silicon
vias
;
Electroplated copper
;
Protrusion
;
Annealing
;
Grain size
刊名:Microelectronics Reliability
出版年:2016
3.
Low-loss shielded through-silicon
vias
filled
with multi-walled carbon nanotube bundle
作者:
Jinrong Su
;
Runbo Ma
;
Xinwei Chen
;
Liping Han
;
Rongcao Yang
;
Wenmei Zhang
;
zhangwm@sxu.edu.cn
关键词:
Forward transmission coefficient
;
Multi-walled carbon nanotube (MWCNT)
;
Propagation constant
;
Through-silicon via (TSV)
;
Time delay
刊名:Microelectronics Journal
出版年:2016
4.
Extreme fast filling of conical shape through-silicon
vias
in 3 minutes and additive optimization
作者:
Van Ha Hoang
a
;
b
;
Kazuo Kondo
a
;
kkondo828@gmail.com" class="auth_mail" title="E-mail the corresponding author
关键词:
Conical TSV
;
extreme fast filling
;
cuprous
;
vortex
;
electrodeposition
刊名:Electrochimica Acta
出版年:2016
5.
Processing Issues and the Characterization of Soft Electrochemical 3D Sensor
作者:
Heftsi Ragones
a
;
heftsira@post.tau.ac.il" class="auth_mail" title="E-mail the corresponding author
;
David Schreiber
a
;
Alexandra Inberg
a
;
Olga Berkh
a
;
Gá
;
bor Kó
;
sa
b
;
Yosi Shacham-Diamand
a
关键词:
bioelectrochemistry
;
polymeric sensor
;
3D printing
;
PDMS
刊名:Electrochimica Acta
出版年:2015
6.
Fabrication of through-silicon
vias
by supercritical CO
2
emulsion-enabled nickel electroplating
作者:
Ho-Chiao Chuang
;
hchuang@mail.ntut.edu.tw" class="auth_mail
;
Wei-Hong Lai
关键词:
TSV
;
Supercritical-CO2
;
Emulsion
;
Nickel electroplating
;
3D integration
;
Packaging
刊名:Materials Science in Semiconductor Processing
出版年:July, 2014
7.
3D-interconnect: Visualization of extrusion and voids induced in copper-
filled
through-silicon
vias
(TSVs) at various temperatures using X-ray microscopy
作者:
LayWai Kong
a
;
lkong@uamail.albany.edu
;
Andrew C. Rudack
b
;
Peter Krueger
c
;
Ehrenfried Zschech
c
;
Sitaram Arkalgud
b
;
A.C. Diebold
a
关键词:
X-ray microscopy
;
TSV
;
3D-interconnect
;
Void inspection
;
Void induced
;
Copper extrusion
;
Round TSVs
;
3D X-ray tomography
刊名:Microelectronic Engineering
出版年:2012
8.
Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si
vias
作者:
Fumihiro Inoue
a
;
b
;
Harold Philipsen
a
;
Harold.Philipsen@imec.be
;
Aleksandar Radisic
a
;
Silvia Armini
a
;
Yann Civale
a
;
Peter Leunissen
a
;
Muneharu Kondo
c
;
Eric Webb
c
;
Shoso Shingubara
b
关键词:
Electroless deposition
;
Through-Si via
;
Seed layer
;
Ruthenium
刊名:Electrochimica Acta
出版年:2013
9.
Fabrication of contact holes by rear side laser ablation of polyimide foils for CIGS solar modules
作者:
Martin Ehrhardt
a
;
Christian Scheit
b
;
Steffen Ragnow
b
;
Pierre Lorenz
a
;
Anja Wehrmann
a
;
Alexander Braun
b
;
Klaus Zimmer
a
;
klaus.zimmer@iom-leipzig.de
;
zimmer@rz.uni-leipzig.de
关键词:
Laser
;
Laser ablation
;
Polyimide
;
Contact resistance
;
Serial interconnection
;
CIGS
;
Solar module
刊名:Applied Surface Science
出版年:2013
10.
Ku-band bandpass filters using novel micromachined substrate integrated waveguide structure with embedded silicon
vias
in benzocyclobutene dielectrics
作者:
Ik-Jae Hyeon
;
Woo-Young Park
;
Sungjoon Lim
;
sungjoon@cau.ac.kr
;
Chang-Wook Baek
;
cwbaek@cau.ac.kr
关键词:
Substrate integrated waveguide (SIW)
;
Bandpass filter (BPF)
;
Complementary split-ring resonators (CSRRs)
;
Micromachining process
刊名:Sensors and Actuators A: Physical
出版年:2012
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