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内部出版物
在“
Elsevier电子期刊
”中,
命中:
11
条,耗时:小于0.01 秒
1.
Heat transfer enhancement of LEDs with a combination of piezoelectric fans and a heat sink
作者:
S.F. Sufian
a
;
sufianfarid@gmail.com
;
M.Z. Abdullah
b
关键词:
LED package
;
Piezoelectric fan
;
Heat sink
;
Transient numerical simulation
;
MpCCI
;
Junction temperature
刊名:Microelectronics Reliability
出版年:2017
2.
Fluid-thermal analysis of aerodynamic heating over spiked blunt body configurations
作者:
Qihao Qin
qinqh@nuaa.edu.cn
;
Jinglei Xu
;
xujl@nuaa.edu.cn
;
Shuai Guo
shuaiguo0916@nuaa.edu.cn
关键词:
APIs
;
Application Programming Interfaces
;
MpCCI
;
Mesh-based parallel Code Coupling Interface
;
RANS
;
Reynolds-Averaged Navier-Stokes
;
SST
;
Shear Stress Transport
刊名:Acta Astronautica
出版年:2017
3.
Effect of synchronized piezoelectric fans on microelectronic cooling performance
作者:
S.F. Sufian
a
;
sufianfarid@gmail.com
;
M.Z. Abdullah
a
;
J.J. Mohamed
b
关键词:
Electronic cooling
;
Piezoelectric fan
;
Transient numerical simulation
;
Fluent
;
MpCCI
;
Heat transfer enhancement
刊名:International Communications in Heat and Mass Transfer
出版年:2013
4.
Influence of solder bump arrangements on molded IC encapsulation
作者:
C.Y. Khor
;
cykhor_1985@hotmail.com" class="auth_mail
;
mecykhor@eng.usm.my" class="auth_mail
;
M.Z. Abdullah
;
Chun-Sean Lau
;
W.C. Leong
;
M.S. Abdul Aziz
刊名:Microelectronics Reliability
出版年:April, 2014
5.
Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance
作者:
W.C. Leong
;
weichiat2008@hotmail.com
;
M.Z. Abdullah
;
C.Y. Khor
刊名:Microelectronics Reliability
出版年:2012
6.
Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method
作者:
Chun-Sean Lau
a
;
chun_sean@hotmail.com
;
M.Z. Abdullah
a
;
F. Che Ani
b
刊名:Microelectronics Reliability
出版年:2012
7.
Study on the fluid/structure interaction at different inlet pressures in molded packaging
作者:
C.Y.
;
Khor
a
;
;
cykhor_1985@hotmail.com
;
M.Z.
;
Abdullah
a
;
F.
;
Che Ani
b
关键词:
Fluid structure interaction (FSI)
;
Finite volume method (FVM)
;
Finite element method (FEM)
;
Molded package
刊名:Microelectronic Engineering
出版年:2011
8.
Fluid-structure interaction analysis of large-break loss of coolant accident
作者:
Tellervo Br
t ;
Ville Lestinen
;
Timo Toppila
;
Jukka Kä
;
hkö
;
nen
;
Antti Timperi
;
Timo Pä
;
ttikangas
;
Ismo Karppinen
刊名:Nuclear Engineering and Design
出版年:2010
9.
Aeroacoustic study of a forward facing step using linearized Euler equations
作者:
Irfan Ali
;
Stefan Becker
;
Jens Utzmann
;
Claus-Dieter Munz
关键词:
Aeroacoustics
;
Large eddy simulation
;
Linearized Euler equation
;
MpCCI
刊名:Physica D
出版年:2008
10.
Grid movement techniques and their influence on laminar fluid–structure interaction computations
作者:
S. Yigit
;
M. Schä
;
fer
;
M. Heck
关键词:
Elliptic
;
FSI
;
Grid generation
;
Large deformations
刊名:Journal of Fluids and Structures
出版年:2008
1
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