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内部出版物
SpringerLink电子期刊(4)
Elsevier电子期刊(1)
ACS电子期刊(3)
在“
SpringerLink电子期刊
”中,
命中:
4
条,耗时:0.0110221 秒
在所有数据库中总计命中:
8
条
1.
Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics
作者:
Won Sik Hong
;
Chulmin
Oh
;
Mi-Song Kim
;
Young Woo Lee…
关键词:
Automotive electronics
;
Pb
;
free
;
solder joint
;
degradation
;
end
;
of
;
life vehicles (ELV)
刊名:Journal of Electronic Materials
出版年:2016
2.
Bonding copper ribbons on crystalline photovoltaic modules using various lead-free solders
作者:
Chulmin
Oh
;
Ayoung Kim
;
Juhee Kim…
刊名:Journal of Materials Science: Materials in Electronics
出版年:2015
3.
Silver stress migration bonding driven by thermomechanical stress with various substrates
作者:
Chulmin
Oh
(1) (2)
Shijo Nagao (2)
Katsuaki Suganuma (2)
1. Department of Adaptive Machine Systems
;
Osaka University
;
8-1 Mihogaoka
;
Ibaraki
;
Osaka
;
567-0047
;
Japan
2. Institute of Scientific and Industrial Research
;
Osaka University
;
8-1 Mihogaoka
;
Ibaraki
;
Osaka
;
567-0047
;
Japan
刊名:Journal of Materials Science: Materials in Electronics
出版年:2015
4.
Pressureless Bonding Using Sputtered Ag Thin Films
作者:
Chulmin
Oh
(1) (2)
Shijo Nagao (2)
Katsuaki Suganuma (2)
关键词:
Bonding
;
thin films
;
abnormal grain growth
;
semiconductor devices
刊名:Journal of Electronic Materials
出版年:2014
1
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